公开(公告)号：US09491854B2

公开(公告)日：2016-11-08

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

公开(公告)号：US20130319732A1

公开(公告)日：2013-12-05

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

公开(公告)号：US20180175476A1

公开(公告)日：2018-06-21

申请号：US15381286

申请日：2016-12-16

Applicant: Raytheon Company

Inventor： Mary A. Teshiba ,  Jason G. Milne ,  Kevin C. Rolston ,  John J. Drab

IPC: H01Q1/02 ,  H01L25/18 ,  H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01Q21/00 ,  H01Q3/36 ,  H01Q1/52

Abstract: In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. An RF signal path through the oxide-bonded wafers comprises a first portion that propagates toward the beam former and a second portion that propagates parallel to the beam former.

公开(公告)号：US11195779B2

公开(公告)日：2021-12-07

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

公开(公告)号：US20210043542A1

公开(公告)日：2021-02-11

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, JR. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  G06F1/20 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

公开(公告)号：US10541461B2

公开(公告)日：2020-01-21

申请号：US15381286

申请日：2016-12-16

Applicant: Raytheon Company

Inventor： Mary A. Teshiba ,  Jason G. Milne ,  Kevin C. Rolston ,  John J. Drab

IPC: H01Q1/02 ,  H01L25/18 ,  H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01Q1/52 ,  H01Q21/00 ,  H01Q3/36

Abstract: In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. An RF signal path through the oxide-bonded wafers comprises a first portion that propagates toward the beam former and a second portion that propagates parallel to the beam former.