公开(公告)号：US11195779B2

公开(公告)日：2021-12-07

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

公开(公告)号：US20210043542A1

公开(公告)日：2021-02-11

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, JR. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  G06F1/20 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.