公开(公告)号：US10791632B1

公开(公告)日：2020-09-29

申请号：US16577528

申请日：2019-09-20

Applicant: RAYTHEON COMPANY

Inventor： Chad E. Patterson ,  Michael M. Fitzgibbon

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/04

Abstract: A board element for board-to-board interconnect formation is provided. An embodiment includes embedding a signal via element in the board element and cutting through respective sections of the board element and the signal via element to expose a new board element edge and an outwardly facing surface of the signal via element.

公开(公告)号：US20150270671A1

公开(公告)日：2015-09-24

申请号：US14223028

申请日：2014-03-24

Applicant: Raytheon Company

Inventor： John J. Wootan ,  Clifton Quan ,  Chad E. Patterson ,  Michael D Runyan

IPC: H01P1/06

CPC classification number: H01P1/068 ,  H01P1/067 ,  H01R39/08

Abstract: A rotary joint includes a contactless electrical connection that has an annular shape, not extending into a central region surrounded and defined by the annular contactless electrical connection. The annular shape of the electrical connection portions allows other uses for the central region, such as for passing an optical signal through the rotary joint. Feeds are coupled to annular waveguide structures in both halves of the rotary joint, for input and output of signals. The feeds may provide connections to the annular waveguide structures at regularly-spaced circumferential intervals around the waveguide structures, such as at about every half-wavelength of the incoming (and outgoing) signals. The annular waveguide structures propagate signals in an axial direction, parallel to the axis of rotation of the rotary joint. The signals propagate contactlessly (non-electrically-conductively) across a gap in the axial direction between the two annular waveguides.

Abstract translation: 旋转接头包括具有环形形状的非接触电连接，不延伸到由环形非接触式电连接包围和限定的中心区域中。 电连接部分的环形允许用于中心区域的其他用途，例如使光信号通过旋转接头。 进料耦合到旋转接头的两个半部中的环形波导结构，用于信号的输入和输出。 进料可以围绕波导结构以规则间隔的圆周间隔提供连接到环形波导结构，例如在输入（和输出）信号的大约每半个波长处。 环形波导结构在与旋转接头的旋转轴线平行的轴向方向上传播信号。 信号通过两个环形波导之间的轴向上的间隙非接触地（非导电地）传播。

公开(公告)号：US11195779B2

公开(公告)日：2021-12-07

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

公开(公告)号：US20210043542A1

公开(公告)日：2021-02-11

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, JR. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  G06F1/20 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.