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    Radiator, solderless interconnect thereof and grounding element thereof
    1.
    发明授权
    Radiator, solderless interconnect thereof and grounding element thereof 有权

    公开(公告)号：US10333212B2

    公开(公告)日：2019-06-25

    申请号：US15494039

    申请日：2017-04-21

    Applicant: Raytheon Company

    Inventor： Alberto F. Viscarra ,  Jayna Shah

    IPC: H01R12/00 ,  H01Q1/48 ,  H01R4/48 ,  H01R4/64 ,  H01Q13/10 ,  H05K1/11 ,  H01Q13/08 ,  H01Q21/00 ,  H01Q21/06

    Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

    Electronic module for motherboard
    5.
    发明授权
    Electronic module for motherboard 有权

    公开(公告)号：US11195779B2

    公开(公告)日：2021-12-07

    申请号：US16828933

    申请日：2020-03-24

    Applicant: RAYTHEON COMPANY

    Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

    IPC: H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

    Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

    RADIATOR, SOLDERLESS INTERCONNECT THEREOF AND GROUNDING ELEMENT THEREOF
    8.
    发明申请
    RADIATOR, SOLDERLESS INTERCONNECT THEREOF AND GROUNDING ELEMENT THEREOF 有权
    散热器，无焊接接头及其接地元件

    公开(公告)号：US20160181692A1

    公开(公告)日：2016-06-23

    申请号：US14579568

    申请日：2014-12-22

    Applicant: Raytheon Company

    Inventor： Alberto F. Viscarra ,  Jayna Shah

    IPC: H01Q1/48 ,  H05K1/11 ,  H01Q13/10 ,  H01R4/48 ,  H01R4/64

    CPC classification number: H01Q1/48 ,  H01Q13/085 ,  H01Q13/10 ,  H01Q21/0006 ,  H01Q21/0025 ,  H01Q21/0087 ,  H01Q21/064 ,  H01Q21/067 ,  H01R4/48 ,  H01R4/64 ,  H05K1/111

    Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

    Abstract translation: 散热器包括：孔板，其在第一和第二横向方向上限定多个槽，布置在每个多个槽中的弹簧探针，每个具有主表面和次表面的印刷电路板（PCB），并且凹陷在 所述次表面限定多个焊盘，其电镀有与PCB电路和接地元件电互连的导电焊盘材料。 每个PCB被布置成相应的一个次表面插入槽中，使得PCB形成十字交叉图案，并且焊盘与与对应的PCB平面在同一平面内的弹簧探针形成水平的盲配接触。 接地元件插入在交叉PCB对之间的互补缺口处。

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