公开(公告)号：US09876283B2

公开(公告)日：2018-01-23

申请号：US14309339

申请日：2014-06-19

Applicant: Raytheon Company

Inventor： John A. Crockett, Jr. ,  David W. Francel ,  Amanda N. Berkes

IPC: H01Q21/06 ,  H01Q3/24 ,  H01Q13/08 ,  H01Q21/00

CPC classification number: H01Q21/061 ,  H01Q3/24 ,  H01Q13/085 ,  H01Q21/0087 ,  H01Q21/064

Abstract: An antenna is provided and includes a plate and an aperture assembly attached to the plate. The aperture assembly includes sticks that respectively include a spacer, a carrier formed separately from the spacer and on which circulators are disposed, a base defining recesses from which bosses interleaved with the recesses protrude and fasteners disposed to fasten the spacer to the base at boss locations with the carrier interposed between the spacer and the base and the circulators aligned with the recesses. The aperture assembly further includes conductive elements extending through the plate and the base for electric coupling to the circulators. Adjacent sticks define a slot extending forwardly from the plate. The slot is notched at a corresponding circulator and rounded forwardly from the corresponding circulator.

公开(公告)号：US11205856B2

公开(公告)日：2021-12-21

申请号：US16828837

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： John A. Crockett, Jr. ,  James A. Carr ,  Larry C. Martin

IPC: H01Q21/00

Abstract: An array antenna. In some embodiments, the array antenna includes a base plate having a surface including a plurality of grooves, a plurality of circulator carriers on the base plate, a plurality of cover strips on the circulator carriers, a plurality of circulators, and a plurality of threaded fasteners. The circulator carriers and the cover strips may be secured to the base plate by the threaded fasteners. Each of the circulators may be coplanar with the base plate. Materials in the array antenna may be selected to avoid galvanic corrosion.

公开(公告)号：US11195779B2

公开(公告)日：2021-12-07

申请号：US16828933

申请日：2020-03-24

Applicant: RAYTHEON COMPANY

Inventor： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

IPC: H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.