公开(公告)号：US09413049B2

公开(公告)日：2016-08-09

申请号：US14223028

申请日：2014-03-24

Applicant: Raytheon Company

Inventor： John J Wootan ,  Clifton Quan ,  Chad E Patterson ,  Michael D Runyan

IPC: H01P1/06 ,  H01R39/08

CPC classification number: H01P1/068 ,  H01P1/067 ,  H01R39/08

Abstract: A rotary joint includes a contactless electrical connection that has an annular shape, not extending into a central region surrounded and defined by the annular contactless electrical connection. The annular shape of the electrical connection portions allows other uses for the central region, such as for passing an optical signal through the rotary joint. Feeds are coupled to annular waveguide structures in both halves of the rotary joint, for input and output of signals. The feeds may provide connections to the annular waveguide structures at regularly-spaced circumferential intervals around the waveguide structures, such as at about every half-wavelength of the incoming (and outgoing) signals. The annular waveguide structures propagate signals in an axial direction, parallel to the axis of rotation of the rotary joint. The signals propagate contactlessly (non-electrically-conductively) across a gap in the axial direction between the two annular waveguides.

Abstract translation: 旋转接头包括具有环形形状的非接触电连接，不延伸到由环形非接触式电连接包围和限定的中心区域中。 电连接部分的环形允许用于中心区域的其他用途，例如使光信号通过旋转接头。 进料耦合到旋转接头的两个半部中的环形波导结构，用于信号的输入和输出。 进料可以围绕波导结构以规则间隔的圆周间隔提供连接到环形波导结构，例如在输入（和输出）信号的大约每半个波长处。 环形波导结构在与旋转接头的旋转轴线平行的轴向方向上传播信号。 信号通过两个环形波导之间的轴向上的间隙非接触地（非导电地）传播。

公开(公告)号：US20150270671A1

公开(公告)日：2015-09-24

申请号：US14223028

申请日：2014-03-24

Applicant: Raytheon Company

Inventor： John J. Wootan ,  Clifton Quan ,  Chad E. Patterson ,  Michael D Runyan

IPC: H01P1/06

CPC classification number: H01P1/068 ,  H01P1/067 ,  H01R39/08

Abstract: A rotary joint includes a contactless electrical connection that has an annular shape, not extending into a central region surrounded and defined by the annular contactless electrical connection. The annular shape of the electrical connection portions allows other uses for the central region, such as for passing an optical signal through the rotary joint. Feeds are coupled to annular waveguide structures in both halves of the rotary joint, for input and output of signals. The feeds may provide connections to the annular waveguide structures at regularly-spaced circumferential intervals around the waveguide structures, such as at about every half-wavelength of the incoming (and outgoing) signals. The annular waveguide structures propagate signals in an axial direction, parallel to the axis of rotation of the rotary joint. The signals propagate contactlessly (non-electrically-conductively) across a gap in the axial direction between the two annular waveguides.

Abstract translation: 旋转接头包括具有环形形状的非接触电连接，不延伸到由环形非接触式电连接包围和限定的中心区域中。 电连接部分的环形允许用于中心区域的其他用途，例如使光信号通过旋转接头。 进料耦合到旋转接头的两个半部中的环形波导结构，用于信号的输入和输出。 进料可以围绕波导结构以规则间隔的圆周间隔提供连接到环形波导结构，例如在输入（和输出）信号的大约每半个波长处。 环形波导结构在与旋转接头的旋转轴线平行的轴向方向上传播信号。 信号通过两个环形波导之间的轴向上的间隙非接触地（非导电地）传播。

公开(公告)号：US09491854B2

公开(公告)日：2016-11-08

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

公开(公告)号：US20130319732A1

公开(公告)日：2013-12-05

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。