公开(公告)号：US12057640B2

公开(公告)日：2024-08-06

申请号：US17951052

申请日：2022-09-22

Applicant: QUALCOMM Incorporated

Inventor： Assaf Aviv ,  Taesik Yang ,  Mohammad Ali Tassoudji ,  Kevin Hsi-Huai Wang

IPC: H01Q21/24 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q21/24 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/045

Abstract: An antenna assembly includes an array of patch antennas arranged above a rectangular ground plane. The patch antennas are arranged in a sequence beginning at a first end of the rectangular ground plane and continuing across a width of the rectangular ground plane to a second end. With regard to this sequence, a plurality of polarization feeds alternate between being adjacent a first corner to being adjacent a second corner of the patch antennas and/or a plurality of via walls alternate in orientation along portions of a first edge of the rectangular ground plane and along portions of a second edge of the rectangular ground plane.

公开(公告)号：US20200212569A1

公开(公告)日：2020-07-02

申请号：US16727640

申请日：2019-12-26

Applicant: QUALCOMM Incorporated

Inventor： Jeong Il Jay KUMAR ,  Alberto Cicalini ,  Mohammed Ali Tassoudji ,  Jordi Fabrega ,  Taesik Yang ,  Kevin Hsi-Huai Wang

IPC: H01Q5/307 ,  H01Q1/42 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, the and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.

公开(公告)号：US20220278452A1

公开(公告)日：2022-09-01

申请号：US17749495

申请日：2022-05-20

Applicant: QUALCOMM Incorporated

Inventor： Jeongil Jay Kim ,  Alberto Cicalini ,  Mohammad Ali Tassoudji ,  Jorge Fabrega Sanchez ,  Taesik Yang ,  Kevin Hsi-Huai Wang

IPC: H01Q5/307 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/42

Abstract: An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.

公开(公告)号：US11362421B2

公开(公告)日：2022-06-14

申请号：US16727640

申请日：2019-12-26

Applicant: QUALCOMM Incorporated

Inventor： Jeongil Jay Kim ,  Alberto Cicalini ,  Mohammad Ali Tassoudji ,  Jorge Fabrega Sanchez ,  Taesik Yang ,  Kevin Hsi-Huai Wang

IPC: H01Q5/307 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/42

Abstract: An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, the and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.

公开(公告)号：US12136766B2

公开(公告)日：2024-11-05

申请号：US18138542

申请日：2023-04-24

Applicant: QUALCOMM Incorporated

Inventor： Taesik Yang ,  Jorge Fabrega Sanchez ,  Mohammad Ali Tassoudji ,  Kevin Hsi-Huai Wang ,  Jeongil Jay Kim

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q5/364 ,  H01Q5/385

Abstract: Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.

公开(公告)号：US20230307817A1

公开(公告)日：2023-09-28

申请号：US17651324

申请日：2022-02-16

Applicant: QUALCOMM Incorporated

Inventor： Suhyung Hwang ,  Kun Fang ,  Jaehyun Yeon ,  Chin-Kwan Kim ,  Taesik Yang

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01Q9/045 ,  H01Q21/065

Abstract: Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods. The antenna module includes a radiofrequency (RF) IC (RFIC) package that includes one or more RFICs for supporting RF communications and a package substrate that includes one or more metallization layers with formed metal interconnects for routing of signals between the RFICs and an antenna(s) in the package substrate. The package substrate includes one or more patch antennas that are planar-shaped and vertically integrated in a plurality of metallization layers in the package substrate, behaving electromagnetically as a patch antenna. In this manner, the patch antenna(s) can be formed as a vertically-integrated structure in the package substrate with fabrication methods used for fabricating metal interconnects and vias (e.g., a micro via fabrication process) in package substrates.

公开(公告)号：US11245175B2

公开(公告)日：2022-02-08

申请号：US16145100

申请日：2018-09-27

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon Jeong ,  Rajneesh Kumar ,  Mohammad Ali Tassoudji ,  Darryl Jessie ,  Gurkanwal Sahota ,  Kevin Hsi Huai Wang ,  Jeong Il Kim ,  Taesik Yang ,  Thomas Myers ,  Neil Burns ,  Julio Zegarra ,  Clinton James Wilber ,  Jordan Szabo

IPC: H01Q1/24 ,  H01Q1/22 ,  H01L25/065 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52 ,  H01Q9/06 ,  H01Q9/26 ,  H01Q21/28 ,  H01L23/31 ,  H01Q9/04

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20190123425A1

公开(公告)日：2019-04-25

申请号：US16163310

申请日：2018-10-17

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon Jeong ,  Mohammad Ali Tassoudji ,  Alireza Mohammadian ,  Jorge Fabrega Sanchez ,  Taesik Yang

IPC: H01Q1/24 ,  H01Q9/28 ,  H01Q21/06 ,  H01Q1/52

Abstract: Methods, systems, and devices for wireless communications are described. An antenna structure for wideband coverage may include a first bowtie antenna disposed in a first plane. The first bowtie antenna may be, for example, an elliptical bowtie antenna or a triangular bowtie antenna. The antenna structure may also include a plurality of additional bowtie antennas, each of the plurality of additional bowtie antennas disposed in a different plane parallel to the first plane. The first bowtie antenna and the plurality of additional bowtie antennas may be stacked in a first direction perpendicular to the first plane to form a bowtie antenna stack. The antenna structure may include a plurality of bowtie antenna stacks. The antenna structure may also include a staggered conductive wall.

公开(公告)号：US12212082B2

公开(公告)日：2025-01-28

申请号：US17951924

申请日：2022-09-23

Applicant: QUALCOMM Incorporated

Inventor： Mahmoud Niroo Jazi ,  Mohammad Ali Tassoudji ,  Taesik Yang ,  Jeongil Jay Kim ,  Darryl Sheldon Jessie ,  Kevin Hsi-Huai Wang ,  Jorge Fabrega Sanchez ,  Hong-Ming Lee

IPC: H01Q9/04 ,  H01Q9/16 ,  H01Q1/24

Abstract: An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.

公开(公告)号：US11735804B2

公开(公告)日：2023-08-22

申请号：US16871822

申请日：2020-05-11

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi Zhang ,  Suhyung Hwang ,  Jaehyun Yeon ,  Taesik Yang ,  Jeongil Jay Kim ,  Darryl Sheldon Jessie ,  Mohammad Ali Tassoudji

IPC: H01Q1/38 ,  H01Q1/12 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H01Q1/12 ,  H05K1/0243 ,  H05K3/0047 ,  H05K3/4644 ,  H05K2201/10098

Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.