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1.发明申请NONWOVEN FABRIC, AIR PURIFIER USING THE SAME, AND METHOD FOR PRODUCING NONWOVEN FABRIC 审中-公开非织造布，使用其的空气净化器以及生产非织造织物的方法公开(公告)号：US20160199765A1
公开(公告)日：2016-07-14
申请号：US14977976
申请日：2015-12-22
Inventor： Koji MOTOMURA , Takayoshi YAMAGUCHI , Yuki YOSHIOKA
CPC classification number: B01D39/1623 , B01D2239/025 , B01D2239/0631 , D04H1/005 , D04H1/4382 , D04H1/541 , D04H1/728
Abstract: A nonwoven fabric includes a nanofiber. The nanofiber includes a core portion and a sheath portion covering at least a part of a surface of the core portion. The core portion includes a first polymer. The sheath portion includes a second polymer. The second polymer is smaller in polarity than the first polymer.
Abstract translation: 无纺布包括纳米纤维。 纳米纤维包括芯部和覆盖芯部的表面的至少一部分的鞘部。 芯部分包括第一聚合物。 护套部分包括第二聚合物。 第二聚合物的极性比第一聚合物小。
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公开(公告)号：US20240282594A1
公开(公告)日：2024-08-22
申请号：US18564807
申请日：2022-02-21
Inventor： Tadashi MAEDA , Shingo OKAMURA , Yuki YOSHIOKA , Tadahiko SAKAI
IPC: H01L21/60
CPC classification number: H01L21/60 , H01L2021/6006
Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film 13 in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the plurality of lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the second thermoplastic resin is equal to or lower than the softening point of the first thermoplastic resin.
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公开(公告)号：US20160258092A1
公开(公告)日：2016-09-08
申请号：US14938469
申请日：2015-11-11
Inventor： Yuki YOSHIOKA , Takayoshi YAMAGUCHI , Takahiro KUROKAWA
IPC: D04H3/018 , G01N33/543
CPC classification number: D04H3/018 , D04H1/4391 , D04H1/728 , G01N33/521
Abstract: A nonwoven fabric includes a fiber including a first portion and a second portion connected to the first portion. A first fiber diameter of the first portion is smaller than a reference fiber diameter. A second fiber diameter of the second portion is equal to or greater than the reference fiber diameter. The reference fiber diameter is smaller than 1 μm. A ratio of a maximum fiber diameter of the second portion to a length of a linear line connecting both end portions of the second portion is from 1/10 to ⅓.
Abstract translation: 无纺布包括纤维，其包括连接到第一部分的第一部分和第二部分。 第一部分的第一纤维直径小于参考纤维直径。 第二部分的第二纤维直径等于或大于参考纤维直径。 参考纤维直径小于1μm。 第二部分的最大纤维直径与连接第二部分的两个端部的直线的长度之比为1/10至1/3。
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Patent Agency Ranking
公开(公告)号：US20240196545A1
公开(公告)日：2024-06-13
申请号：US18550317
申请日：2021-10-07
Inventor： Yuki YOSHIOKA , Tadahiko SAKAI , Tadashi MAEDA , Shingo OKAMURA
IPC: H05K3/30 , B23K1/00 , B23K1/20 , B23K101/42 , C09J11/06 , C09J193/04 , H05K3/34
CPC classification number: H05K3/305 , B23K1/0016 , B23K1/20 , C09J11/06 , C09J193/04 , H05K3/3442 , B23K2101/42
Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.
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公开(公告)号：US20240268036A1
公开(公告)日：2024-08-08
申请号：US18565172
申请日：2022-02-21
Inventor： Shingo OKAMURA , Tadashi MAEDA , Yuki YOSHIOKA , Tadahiko SAKAI
IPC: H05K3/34 , B23K1/00 , B23K1/20 , B23K101/42
CPC classification number: H05K3/3442 , B23K1/0016 , B23K1/20 , H05K3/3485 , H05K3/3489 , B23K2101/42 , H05K2203/0445
Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.
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公开(公告)号：US20240015893A1
公开(公告)日：2024-01-11
申请号：US18043955
申请日：2021-07-05
Inventor： Masayuki MANTANI , Tadahiko SAKAI , Tadashi MAEDA , Yuki YOSHIOKA
CPC classification number: H05K3/3485 , H05K1/181 , H05K3/3489 , H05K3/1275 , H05K2203/0195 , H05K2203/0143
Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.
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7.发明申请公开(公告)号：US20190284388A1
公开(公告)日：2019-09-19
申请号：US16298038
申请日：2019-03-11
Inventor： Yuki YOSHIOKA , Arata KISHI
Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.
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公开(公告)号：US20160281284A1
公开(公告)日：2016-09-29
申请号：US14997150
申请日：2016-01-15
Inventor： Yuki YOSHIOKA , Takayoshi YAMAGUCHI
IPC: D04H13/00
CPC classification number: D04H1/413 , D04H1/4242 , D04H1/43 , D04H1/728 , D10B2101/12 , D10B2321/10 , D10B2331/14
Abstract: A non-woven fabric includes nanofibers which contain a polymer and inorganic particles, the nanofibers being formed by an electrospinning method. The inorganic particles contain first particles and second particles, some parts of which are exposed from a surface of the polymer. A volume V1o of a portion of the first particles exposed from the surface of the polymer and a volume V1i of a portion buried in the polymer satisfy a relationship of V1o N2.
Abstract translation: 无纺布包括含有聚合物和无机颗粒的纳米纤维，纳米纤维通过静电纺丝法形成。 无机颗粒包含第一颗粒和第二颗粒，其一部分从聚合物的表面露出。 从聚合物表面露出的第一粒子的一部分的体积V1o和埋在聚合物中的部分的体积V1i满足V1o
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