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公开(公告)号：US09601818B2
公开(公告)日：2017-03-21
申请号：US14420265
申请日：2014-06-03
Inventor： Suguru Fujita , Maki Nakamura
IPC: H01L23/538 , H01P3/08 , H01L23/31 , H01L23/66 , H01L23/00 , H01L25/065
CPC classification number: H01P3/08 , H01L23/3121 , H01L23/5385 , H01L23/5386 , H01L23/5389 , H01L23/66 , H01L24/16 , H01L25/0655 , H01L2223/6677 , H01L2224/16225 , H01L2924/12042 , H01L2924/1533 , H01L2924/00
Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members. In the microwave circuit, the plurality of first electrically conductive members and the plurality of second electrically conductive members are alternately disposed along an end portion of the first substrate.
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公开(公告)号：US20150249283A1
公开(公告)日：2015-09-03
申请号：US14428666
申请日：2014-06-10
Inventor： Kentaro Watanabe , Yuichi Kashino , Suguru Fujita , Kohei Sugimoto , Ryosuke Shiozaki
IPC: H01Q1/24
Abstract: A wireless device that suppresses deterioration of antenna characteristics and can be made thin is provided. The wireless device is provided with a substrate, a wireless module that is mounted on the substrate and has an antenna unit, and a casing that accommodates the substrate and the wireless module. The wireless device has a gap of a length that is an approximate multiple of a half-wavelength of a radio wave corresponding to a communication frequency of the antenna unit, from the antenna unit toward the casing.
Abstract translation: 提供抑制天线特性劣化并且可以变薄的无线装置。 无线装置设置有基板，安装在基板上并具有天线单元的无线模块以及容纳基板和无线模块的壳体。 无线装置具有与天线单元的通信频率相对应的从天线单元朝向壳体的无线电波的半波长的近似倍数的间隔。
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公开(公告)号：US09293419B2
公开(公告)日：2016-03-22
申请号：US14680039
申请日：2015-04-06
Inventor： Maki Nakamura , Suguru Fujita
IPC: H01L23/58 , H01L23/538 , H01L25/065 , H01L23/00 , H01L23/13 , H01L23/498
CPC classification number: H01L23/5384 , H01L23/13 , H01L23/49811 , H01L24/04 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/16227 , H01L2225/06517 , H01L2225/06572 , H01L2924/1421 , H01L2924/15192 , H01L2924/15311 , H01L2924/15333
Abstract: A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.
Abstract translation: 半导体封装包括：第一衬底，其包括形成有第一焊盘区域和第二焊盘区域的第一表面层，所述第一焊盘区域包括用于连接到第一IC的多个第一焊盘，所述第二焊盘区域包括多个 用于连接到第二基板的第二焊盘以及形成有包括用于连接到第二IC的多个第三焊盘的第三焊盘区域的第二表面层，所述第二表面层形成在所述第一表面层的相对侧上。 第二焊盘以至少三行围绕第一焊盘区域，并且包括在第二焊盘中并且布置在内部部分中的一个或多个焊盘连接到包括在第一焊盘中的一个或多个焊盘以及包括在第一焊盘中的一个或多个焊盘 第三垫。
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公开(公告)号：US20150222003A1
公开(公告)日：2015-08-06
申请号：US14424811
申请日：2014-06-03
Inventor： Suguru Fujita , Ryosuke Shiozaki , Yuichi Kashino , Kentaro Watanabe
IPC: H01P3/08
CPC classification number: H01P3/08 , H01L23/66 , H01L24/00 , H01L2924/0002 , H01P1/04 , H01P5/02 , H01P5/028 , H05K1/0222 , H05K2201/09609 , H01L2924/00
Abstract: A microwave circuit that can suppress deterioration of transmission characteristics and that can be reduced in size is provided. The microwave circuit includes a first transmission line, a second transmission line, a third transmission line that is connected to the first transmission line and the second transmission line and whose line width is different from line width of the first transmission line and line width of the second transmission line, and a first ground conductor that surrounds the first transmission line, the second transmission line, and the third transmission line, respectively, at certain distances.
Abstract translation: 提供了可以抑制传输特性的劣化并且可以减小尺寸的微波电路。 微波电路包括第一传输线，第二传输线，连接到第一传输线和第二传输线的线宽与第一传输线的线宽不同的第三传输线， 第二传输线和分别围绕第一传输线，第二传输线和第三传输线的一定距离的第一接地导体。
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公开(公告)号：US09711862B2
公开(公告)日：2017-07-18
申请号：US14723133
申请日：2015-05-27
Inventor： Suguru Fujita , Maki Nakamura
IPC: H01Q15/02
CPC classification number: H01Q15/02
Abstract: A wireless device includes an antenna that has a planar shape and radiates a radio signal toward another wireless device, and a chassis housing the antenna and having an outer peripheral portion placed to face the antenna. Multiple distances between a surface of the outer peripheral portion and the antenna are non-uniform.
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Patent Agency Ranking
公开(公告)号：US20150207197A1
公开(公告)日：2015-07-23
申请号：US14420265
申请日：2014-06-03
Inventor： Suguru Fujita , Maki Nakamura
IPC: H01P3/08
CPC classification number: H01P3/08 , H01L23/3121 , H01L23/5385 , H01L23/5386 , H01L23/5389 , H01L23/66 , H01L24/16 , H01L25/0655 , H01L2223/6677 , H01L2224/16225 , H01L2924/12042 , H01L2924/1533 , H01L2924/00
Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members. In the microwave circuit, the plurality of first electrically conductive members and the plurality of second electrically conductive members are alternately disposed along an end portion of the first substrate.
Abstract translation: 提供了可以抑制基板中的裂纹并且可以减小包括微波电路的模块的尺寸的微波电路。 微波电路包括多层第一衬底，与第一衬底相对的第二衬底，将第一衬底和第二衬底的第一层彼此电连接的多个第一导电构件，多个第二导电构件 其将第一基板的第一层和第一基板的另一层彼此电连接，并且多个第二导电构件中的每一个具有比每个第一导电构件的直径小的直径，以及连接的传输线 第一导电构件和第二导电构件。 在微波电路中，多个第一导电构件和多个第二导电构件沿着第一基板的端部交替设置。
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公开(公告)号：US09711861B2
公开(公告)日：2017-07-18
申请号：US14722436
申请日：2015-05-27
Inventor： Yuichi Kashino , Hiroyuki Uno , Maki Nakamura , Suguru Fujita
IPC: H01Q13/10
CPC classification number: H01Q13/106
Abstract: An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.
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公开(公告)号：US09666952B2
公开(公告)日：2017-05-30
申请号：US14702040
申请日：2015-05-01
Inventor： Suguru Fujita , Yuichi Kashino , Maki Nakamura , Kentaro Watanabe
CPC classification number: H01Q19/06 , H01L2223/6677 , H01L2224/16227 , H01L2924/15321 , H01Q1/38 , H01Q3/16 , H01Q19/104 , H01Q19/106 , H01Q21/065
Abstract: An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.
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公开(公告)号：US09627741B2
公开(公告)日：2017-04-18
申请号：US14420297
申请日：2014-05-23
Inventor： Suguru Fujita , Ryosuke Shiozaki , Kentaro Watanabe
CPC classification number: H01Q1/02 , H01L2223/6677 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/1532 , H01Q1/2283 , H01Q1/24 , H01Q21/06 , H01Q23/00 , H05K1/0203 , H05K1/0243 , H05K1/0298 , H05K1/141 , H05K2201/10098
Abstract: As a wireless module which is capable of improving heat dissipation while suppressing degradation of antenna characteristics, there is provided a wireless module including: a first substrate having a first surface on which a plurality of antennas and a ground portion are disposed; and a heat dissipating member disposed opposite the first surface of the first substrate. The heat dissipating member includes a plurality of openings corresponding to the plurality of antennas respectively and an intervening portion which intervenes between the plurality of openings. The ground portion is disposed between the first substrate and the heat dissipating member.
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公开(公告)号：US09583817B2
公开(公告)日：2017-02-28
申请号：US14428666
申请日：2014-06-10
Inventor： Kentaro Watanabe , Yuichi Kashino , Suguru Fujita , Kohei Sugimoto , Ryosuke Shiozaki
Abstract: A wireless device that suppresses deterioration of antenna characteristics and can be made thin is provided. The wireless device is provided with a substrate, a wireless module that is mounted on the substrate and has an antenna unit, and a casing that accommodates the substrate and the wireless module. The wireless device has a gap of a length that is an approximate multiple of a half-wavelength of a radio wave corresponding to a communication frequency of the antenna unit, from the antenna unit toward the casing.
Abstract translation: 提供抑制天线特性劣化并且可以变薄的无线装置。 无线装置设置有基板，安装在基板上并具有天线单元的无线模块以及容纳基板和无线模块的壳体。 无线装置具有与天线单元的通信频率相对应的从天线单元朝向壳体的无线电波的半波长的近似倍数的间隔。
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