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    Radio-frequency module
    1.
    发明授权
    Radio-frequency module 有权

    公开(公告)号：US10117327B2

    公开(公告)日：2018-10-30

    申请号：US15017538

    申请日：2016-02-05

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Ryosuke Shiozaki ,  Maki Nakamura ,  Junji Sato

    IPC: H05K1/02 ,  H01L23/66 ,  H05K1/18 ,  H05K1/14 ,  H01L23/00 ,  H01L23/498

    Abstract: A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.

    Semiconductor package and semiconductor device
    3.
    发明授权
    Semiconductor package and semiconductor device 有权
    半导体封装和半导体器件

    公开(公告)号：US09293419B2

    公开(公告)日：2016-03-22

    申请号：US14680039

    申请日：2015-04-06

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Maki Nakamura ,  Suguru Fujita

    IPC: H01L23/58 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

    CPC classification number: H01L23/5384 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/04 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/1421 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15333

    Abstract: A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.

    Abstract translation: 半导体封装包括：第一衬底，其包括形成有第一焊盘区域和第二焊盘区域的第一表面层，所述第一焊盘区域包括用于连接到第一IC的多个第一焊盘，所述第二焊盘区域包括多个 用于连接到第二基板的第二焊盘以及形成有包括用于连接到第二IC的多个第三焊盘的第三焊盘区域的第二表面层，所述第二表面层形成在所述第一表面层的相对侧上。 第二焊盘以至少三行围绕第一焊盘区域，并且包括在第二焊盘中并且布置在内部部分中的一个或多个焊盘连接到包括在第一焊盘中的一个或多个焊盘以及包括在第一焊盘中的一个或多个焊盘 第三垫。

    MICROWAVE CIRCUIT
    6.
    发明申请
    MICROWAVE CIRCUIT 有权
    微波电路

    公开(公告)号：US20150207197A1

    公开(公告)日：2015-07-23

    申请号：US14420265

    申请日：2014-06-03

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Suguru Fujita ,  Maki Nakamura

    IPC: H01P3/08

    CPC classification number: H01P3/08 ,  H01L23/3121 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/1533 ,  H01L2924/00

    Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members. In the microwave circuit, the plurality of first electrically conductive members and the plurality of second electrically conductive members are alternately disposed along an end portion of the first substrate.

    Abstract translation: 提供了可以抑制基板中的裂纹并且可以减小包括微波电路的模块的尺寸的微波电路。 微波电路包括多层第一衬底，与第一衬底相对的第二衬底，将第一衬底和第二衬底的第一层彼此电连接的多个第一导电构件，多个第二导电构件 其将第一基板的第一层和第一基板的另一层彼此电连接，并且多个第二导电构件中的每一个具有比每个第一导电构件的直径小的直径，以及连接的传输线 第一导电构件和第二导电构件。 在微波电路中，多个第一导电构件和多个第二导电构件沿着第一基板的端部交替设置。

    Antenna device
    7.
    发明授权
    Antenna device 有权

    公开(公告)号：US09711861B2

    公开(公告)日：2017-07-18

    申请号：US14722436

    申请日：2015-05-27

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Yuichi Kashino ,  Hiroyuki Uno ,  Maki Nakamura ,  Suguru Fujita

    IPC: H01Q13/10

    CPC classification number: H01Q13/106

    Abstract: An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.

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