Light emitting diode element and method for manufacturing same

    公开(公告)号:US10763395B2

    公开(公告)日:2020-09-01

    申请号:US16295115

    申请日:2019-03-07

    Abstract: A flip-chip light emitting diode element capable of reducing lateral resistance. The flip-chip light emitting diode element includes a stacked body structure configured by sequentially stacking a first n-type group III nitride semiconductor layer having a carrier concentration that is at least 1×1019 cm−3 but less than 3×1020 cm−3, a second n-type group III nitride semiconductor layer having a carrier concentration that is at least 5×1017 cm−3 but less than 1×1019 cm−3, a light-emitting layer formed by a group III nitride semiconductor, and a p-type group III nitride semiconductor layer. A height of unevenness on an interface between the first n-type group III nitride semiconductor layer and the second n-type group III nitride semiconductor layer is greater than that of unevenness of an interface between the second n-type group III nitride semiconductor layer and the light emitting layer.

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