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公开(公告)号：US11476399B2
公开(公告)日：2022-10-18
申请号：US16196785
申请日：2018-11-20
Inventor： Hidetoshi Kitaura , Akio Furusawa , Kiyohiro Hine
Abstract: A jointing material includes: at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt % to 99.9 wt % as a main component.
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公开(公告)号：US11135683B2
公开(公告)日：2021-10-05
申请号：US16137108
申请日：2018-09-20
Inventor： Hidetoshi Kitaura , Akio Furusawa , Kiyohiro Hine
IPC: B23K35/26 , B23K1/00 , B23K31/02 , H01L35/08 , C22C13/02 , H01L23/00 , B23K101/40 , B23K101/42
Abstract: A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
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公开(公告)号：US11318534B2
公开(公告)日：2022-05-03
申请号：US16595445
申请日：2019-10-07
Inventor： Akio Furusawa , Kiyohiro Hine , Shinji Ishitani , Misato Takahashi
Abstract: To provide a method for efficiently producing metal microparticles having a particle diameter of 1 μm to 10 μm, and a device for producing the same. A metal microparticle production method is used, which includes a particle generating step of generating primary particles by irradiating a metal lump in a solvent in a first tank with an ultrasonic wave, and a particle splitting step of irradiating the primary particles with an ultrasonic wave in a solvent in a second tank and splitting the primary particles to produce secondary particles. Further, a metal microparticle production device is used, which includes: a first tank that has a solvent and a metal lump; a first heating unit that heats the solvent in the first tank; a first ultrasonic vibrator that is disposed in the first tank and irradiates the metal lump with an ultrasonic wave to generate primary particles; a second tank that has the solvent and the primary particles; and a second ultrasonic vibrator that irradiates the primary particles with an ultrasonic wave to split the primary particles.
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公开(公告)号：US10960496B2
公开(公告)日：2021-03-30
申请号：US15582507
申请日：2017-04-28
Inventor： Shinnosuke Akiyama , Kiyohiro Hine , Hidetoshi Kitaura , Akio Furusawa
Abstract: There is provided a solder alloy in which 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass %) and [In] is set as an In content percentage (mass %): in a case of 0.5≤[Sb]≤1.0, 5.5≤[In]≤5.50+1.06[Sb] . . . (I), in a case of 1.0
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公开(公告)号：US11515280B2
公开(公告)日：2022-11-29
申请号：US16790372
申请日：2020-02-13
Inventor： Kiyohiro Hine , Hidetoshi Kitaura , Akio Furusawa
Abstract: A mounting structure is used, which includes: a semiconductor element including an element electrode; a metal member; and a sintered body configured to bond the semiconductor element and the metal member is used, in which the sintered body contains a first metal and a second metal solid-dissolved in the first metal, the second metal is a metal having a diffusion coefficient in the first metal larger than a self-diffusion coefficient of the first metal, and a content ratio of the second metal relative to a total mass of the first metal and the second metal in the sintered body is equal to or lower than a solid solution limit of the second metal to the first metal.
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Patent Agency Ranking
公开(公告)号：US09789569B2
公开(公告)日：2017-10-17
申请号：US14920772
申请日：2015-10-22
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
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公开(公告)号：US09199340B2
公开(公告)日：2015-12-01
申请号：US14551007
申请日：2014-11-23
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0
Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
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公开(公告)号：US10170442B2
公开(公告)日：2019-01-01
申请号：US15797296
申请日：2017-10-30
Inventor： Kiyohiro Hine , Akio Furusawa , Hidetoshi Kitaura , Kazuki Sakai
IPC: H01L23/00 , B23K35/26 , C22C13/00 , H01L23/488 , H01L21/52
Abstract: A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.
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公开(公告)号：US10068869B2
公开(公告)日：2018-09-04
申请号：US14880942
申请日：2015-10-12
Inventor： Kiyohiro Hine , Akio Furusawa , Masato Mori , Taichi Nakamura , Hidetoshi Kitaura
Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
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公开(公告)号：US09981348B2
公开(公告)日：2018-05-29
申请号：US15267083
申请日：2016-09-15
Inventor： Kiyohiro Hine , Akio Furusawa , Hidetoshi Kitaura
CPC classification number: B23K35/262 , C22C13/00 , H05K1/181 , H05K3/3457 , H05K3/3463 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
Abstract: A solder alloy is substantially Ag-free and has desirable neat-resistance fatigue characteristics in a high-temperature environment as high as 150° C., even when used for soldering of electronic components having no leads. The solder alloy contains Sb, In, Cu, and Bi, and Sn accounting for the remainder, and satisfies the following formulae: 0.5≤[Sb]≤1.25 0.66[Sb]+4.16≤[In]≤6.0 0.5≤[Cu]≤1.2 0.1≤[Bi]≤0.5, wherein [Sb], [In], [Cu], and [Bi] represent the contents of Sb, In, Cu, and Bi, respectively, in mass %.
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