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公开(公告)号：US11602079B2
公开(公告)日：2023-03-07
申请号：US17367279
申请日：2021-07-02
Inventor： Ryou Kuwabara , Motonori Shimamura , Naomi Nishiki , Masato Mori
Abstract: A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1>Ra2≥Ra3 is satisfied.
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公开(公告)号：US10068869B2
公开(公告)日：2018-09-04
申请号：US14880942
申请日：2015-10-12
Inventor： Kiyohiro Hine , Akio Furusawa , Masato Mori , Taichi Nakamura , Hidetoshi Kitaura
Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
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公开(公告)号：US10290779B2
公开(公告)日：2019-05-14
申请号：US15825058
申请日：2017-11-28
Inventor： Shinnosuke Akiyama , Kei Toyota , Masato Mori
Abstract: A light emitting element includes a light emitting member that is formed of at least two kinds of an oxide material and has a plate shape; and a light transmitting member that collimates a light emitted from the light emitting member and has a plano-convex shape, in which a contact portion between the light transmitting member and the light emitting member is continuous.
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公开(公告)号：US09789569B2
公开(公告)日：2017-10-17
申请号：US14920772
申请日：2015-10-22
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
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Patent Agency Ranking
公开(公告)号：US11322660B2
公开(公告)日：2022-05-03
申请号：US16691527
申请日：2019-11-21
Inventor： Kei Toyota , Shinnosuke Akiyama , Riho Moriyama , Masato Mori
Abstract: A phosphor according to the present disclosure has excellent light emission properties in a blue-green region and high color rendering properties. The phosphor is represented by a chemical formula of Lu(3-x-y-z)MgxZnyAl5O12:Cez, in which when z is in a range of 0.01≤z≤0.03, then 0≤x≤1.4 and 0≤y≤1.4, excluding x=0 and y=0; when z is in a range of is 0.03
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公开(公告)号：US10995935B2
公开(公告)日：2021-05-04
申请号：US16639549
申请日：2018-12-03
Inventor： Kei Toyota , Shinnosuke Akiyama , Masato Mori
Abstract: A phosphor has a plate-shaped phosphor, a joining-member, and a light collecting optical member. The light collecting optical member has at least one convex surface and is fixed to the plate-shaped phosphor by the joining-member. The joining-member forms a fillet shape between a surface of the plate-shaped phosphor to which the light collecting optical member is joined and a convex surface of the light collecting optical member. In a case where a height of the fillet shape from the surface of the plate-shaped phosphor to which the light collecting optical member is joined is set as a height X and a maximum distance of the light collecting optical member from the surface of the plate-shaped phosphor to which the light collecting optical member of is joined is set as a maximum distance Y, the height X is equal to or less than ⅔ of the maximum distance Y.
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公开(公告)号：US10440834B2
公开(公告)日：2019-10-08
申请号：US15352264
申请日：2016-11-15
Inventor： Hirohisa Hino , Naomichi Ohashi , Yuki Yoshioka , Masato Mori , Yasuhiro Suzuki
IPC: C09J163/00 , C09J9/02 , C09J11/02 , C09J11/04 , C09J11/06 , C08K3/10 , C08K3/36 , C08K9/04 , H05K3/34 , H01L23/00 , H05K1/11 , H05K1/18 , B23K35/24 , H01L23/498
Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.
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公开(公告)号：US09881813B2
公开(公告)日：2018-01-30
申请号：US15212158
申请日：2016-07-15
Inventor： Hirohisa Hino , Yasuhiro Suzuki , Masato Mori , Naomichi Ohashi
IPC: H01L21/48 , H01L23/498 , H01L25/065 , H01L23/00 , H01L25/10 , H01L25/00 , H01L21/60
CPC classification number: H01L21/4853 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60007 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/15311
Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.
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公开(公告)号：US09199340B2
公开(公告)日：2015-12-01
申请号：US14551007
申请日：2014-11-23
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0
Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
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