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公开(公告)号:US11011319B2
公开(公告)日:2021-05-18
申请号:US16299786
申请日:2019-03-12
Inventor: Shinji Ishitani , Tatsuo Sasaoka , Renki Yamazaki
Abstract: An electronic component includes an electronic element that includes a lead portion, a sealing body that seals the electronic element in a state where an end portion of the lead portion is exposed, a first current collector that is formed on the sealing body and is connected to the end portion, and a first terminal that includes a first portion which is sealed in the sealing body and is connected to the first current collector.
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公开(公告)号:US11318534B2
公开(公告)日:2022-05-03
申请号:US16595445
申请日:2019-10-07
Inventor: Akio Furusawa , Kiyohiro Hine , Shinji Ishitani , Misato Takahashi
Abstract: To provide a method for efficiently producing metal microparticles having a particle diameter of 1 μm to 10 μm, and a device for producing the same. A metal microparticle production method is used, which includes a particle generating step of generating primary particles by irradiating a metal lump in a solvent in a first tank with an ultrasonic wave, and a particle splitting step of irradiating the primary particles with an ultrasonic wave in a solvent in a second tank and splitting the primary particles to produce secondary particles. Further, a metal microparticle production device is used, which includes: a first tank that has a solvent and a metal lump; a first heating unit that heats the solvent in the first tank; a first ultrasonic vibrator that is disposed in the first tank and irradiates the metal lump with an ultrasonic wave to generate primary particles; a second tank that has the solvent and the primary particles; and a second ultrasonic vibrator that irradiates the primary particles with an ultrasonic wave to split the primary particles.
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