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公开(公告)号：US20220356289A1
公开(公告)日：2022-11-10
申请号：US17763328
申请日：2020-09-18
Inventor： Atsushi WADA , Masashi KODA , Ryusei KOZAWA , Yuki KITAI
IPC: C08F290/06 , C08G65/38 , C08K5/3415 , C08K5/01 , C08K5/3492 , C08K5/3432 , C08K5/22 , C08J5/24 , B32B15/08 , B32B27/26
Abstract: An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in a molecule.
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公开(公告)号：US20220356279A1
公开(公告)日：2022-11-10
申请号：US17762636
申请日：2020-09-18
Inventor： Atsushi WADA , Masashi KODA , Ryusei KOZAWA , Yuki KITAI
IPC: C08F212/36 , C08F212/08 , C08G65/26 , C08G65/329 , C08K5/01 , C08K5/3415 , C08K5/3432 , C08K3/36 , C08K7/14 , C08J5/24 , B32B15/08 , B32B27/20 , B32B27/28
Abstract: An aspect of the present application relates to a resin composition, which contains a polymer having a structural unit represented by Formula (1) in a molecule and a free radical compound and in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (2), (3), (4) and (5) in the molecule.
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公开(公告)号：US20220289969A1
公开(公告)日：2022-09-15
申请号：US17632721
申请日：2020-07-30
Inventor： Masashi KODA , Yuki KITAI , Atsushi WADA , Yasunori HOSHINO
Abstract: An aspect of the present invention is a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.
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Patent Agency Ranking
公开(公告)号：US20220275122A1
公开(公告)日：2022-09-01
申请号：US17632038
申请日：2020-07-30
Inventor： Masashi KODA , Yuki KITAI , Atsushi WADA , Yasunori HOSHINO
IPC: C08F212/08 , C08L25/10 , C08K3/36 , C08J5/24 , C08J5/18 , H05K1/03 , B32B5/02 , B32B5/26 , B32B15/20 , B32B15/14
Abstract: A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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5.发明申请公开(公告)号：US20220220272A1
公开(公告)日：2022-07-14
申请号：US17609695
申请日：2020-05-14
Inventor： Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Atsushi WADA , Mikio SATO
Abstract: A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m2.
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公开(公告)号：US20220159830A1
公开(公告)日：2022-05-19
申请号：US17440528
申请日：2020-03-26
Inventor： Yasunori HOSHINO , Yuki KITAI , Atsushi WADA , Masashi KODA , Mikio SATO
Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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公开(公告)号：US20220106426A1
公开(公告)日：2022-04-07
申请号：US17426400
申请日：2019-12-18
Inventor： Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Atsushi WADA , Mikio SATO
Abstract: A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.
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公开(公告)号：US20210269595A1
公开(公告)日：2021-09-02
申请号：US17256382
申请日：2019-07-09
Inventor： Mikio SATO , Yuki KITAI , Yasunori HOSHINO , Masashi KODA , Atsushi WADA
IPC: C08G65/48 , C08J5/24 , C08F290/06 , H05K1/03
Abstract: An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B). In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
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