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    COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
    3.
    发明申请
    COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS 有权

    公开(公告)号：US20220390970A1

    公开(公告)日：2022-12-08

    申请号：US17819902

    申请日：2022-08-15

    申请人： Octavo Systems LLC

    发明人： Kevin Michael Troy ,  Peter Robert Linder

    IPC分类号： G05F1/46

    摘要： A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be reconfigured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

    Automatic test equipment method for testing system in a package devices
    5.
    发明授权
    Automatic test equipment method for testing system in a package devices 有权

    公开(公告)号：US11309056B2

    公开(公告)日：2022-04-19

    申请号：US16482063

    申请日：2018-01-31

    申请人： Octavo Systems LLC

    发明人： Kevin Michael Troy

    IPC分类号： G11C29/56 ,  G11C29/00 ,  G01R31/00 ,  G01R31/317 ,  G01R31/3181 ,  G01R31/3185

    摘要： Systems, methods, and computer program products directed to testing a System-in-a-Package (SIP) using an Automatic Test Equipment (ATE) machine. A functional representation of one or more tests to be performed in the SIP is loaded in a memory located on a load board, the load board located on the ATE machine. A test controller located on at least one of the SIP and the load board is caused to retrieve and store the one or more tests to be performed in the SIP. The test controller is instructed to conduct the one or more tests in the SIP.