MULTIPLE BEAM INSPECTION APPARATUS AND SENSITIVITY CORRECTION METHOD FOR MULTI-DETECTOR

    公开(公告)号:US20190214221A1

    公开(公告)日:2019-07-11

    申请号:US16237768

    申请日:2019-01-02

    Abstract: A multiple beam inspection apparatus includes a multi-detector to detect multiple secondary electron beams generated because a target object is irradiated with multiple primary electron beams, and to include plural detection pixels each receiving irradiation of a corresponding one of the multiple secondary electron beams, and having a region which receives irradiation of a corresponding secondary electron beam and is larger than the irradiation spot size of the corresponding secondary electron beam, a shifting mechanism to shift irradiation positions of the multiple secondary electron beams irradiating the plural detection pixels, a determination circuitry to determine whether sensitivity of at least one of the plural detection pixels is degraded, and a setting circuitry to set, when sensitivity of at least one detection pixel is degraded, irradiation position shifting destinations of multiple secondary electron beams, irradiating the plural detection pixels, to be within respective corresponding same detection pixels.

    MULTI-ELECTRON BEAM IMAGE ACQUISITION APPARATUS AND MULTI-ELECTRON BEAM IMAGE ACQUISITION METHOD

    公开(公告)号:US20240282547A1

    公开(公告)日:2024-08-22

    申请号:US18647061

    申请日:2024-04-26

    Abstract: A multi-electron beam image acquisition apparatus includes a multiple primary electron beams forming device to form multiple primary electron beams, a first-deflector to scan the multiple-primary electron beams over a target object by deflecting the multiple-primary electron beams, a corrector to correct a beam-array-distribution-shape of multiple-secondary electron beams emitted from the target object irradiated with the multiple-primary electron beams, a second-deflector to deflect the multiple-secondary electron beams whose beam-array-distribution-shape has been corrected, a detector to detect the deflected multiple-secondary electron beams, and a deflection control circuit to control applying, to the second-deflector, a superimposed potential obtained by superimposing a deflection potential which cancels out a position movement of the multiple-secondary electron beams moved along with scanning the multiple-primary electron beams on a correction potential which corrects a distortion being generated due to correcting the beam-array-distribution-shape of the multiple-secondary electron beams and being dependent on a deflection amount for scanning.

    MULTIPLE-BEAM IMAGE ACQUISITION APPARATUS AND MULTIPLE-BEAM IMAGE ACQUISITION METHOD

    公开(公告)号:US20250149290A1

    公开(公告)日:2025-05-08

    申请号:US19009276

    申请日:2025-01-03

    Abstract: A multiple-beam image acquisition apparatus includes a stage to mount thereon a target object, a mark member, arranged on the stage, to include a base body having at least a surface made from the first material, plural isolated patterns, formed on the base body, having the same positional relationship as plural irradiation positions, flush in height with the surface of the target object, of plural beams having been determined previously in multiple primary electron beams, and being made from a material different from the first material, and an alignment mark, an electron optical system to irradiate the mark member with the multiple primary electron beams in the state where alignment of the multiple primary electron beams has been performed using the alignment mark, and a multi-detector to detect multiple secondary electron beams emitted from the mark member because the mark member is irradiated with the multiple primary electron beams.

    MULTI-ELECTRON BEAM INSPECTION APPARATUS AND ADJUSTMENT METHOD FOR THE SAME

    公开(公告)号:US20230080062A1

    公开(公告)日:2023-03-16

    申请号:US18056511

    申请日:2022-11-17

    Abstract: According to the present invention, a desired one of multiple beams can be aligned with a small-diameter aperture quickly. A multi-electron beam inspection apparatus includes a beam selection aperture substrate including a first passage hole that passes all the multiple electron beams, a second passage hole through which one of the multiple electron beams is able to pass, a first slit, and a second slit not parallel to the first slit, an aperture moving unit moving the beam selection aperture substrate, a first detector detecting a current of a beam having passed through the first slit and a current of a beam having passed through the second slit, of the multiple electron beams, and a second detector detecting multiple secondary electron beams including reflected electrons, discharged from a substrate, due to application of the multiple electron beams, having passed through the first passage hole, to the substrate. The substrate is inspected based on an output signal from the second detector.

    MULTIPLE SECONDARY ELECTRON BEAM ALIGNMENT METHOD, MULTIPLE SECONDARY ELECTRON BEAM ALIGNMENT APPARATUS, AND ELECTRON BEAM INSPECTION APPARATUS

    公开(公告)号:US20220365010A1

    公开(公告)日:2022-11-17

    申请号:US17658557

    申请日:2022-04-08

    Abstract: A multiple secondary electron beam alignment method includes scanning a plurality of first detection elements of a multi-detector, which are arrayed in a grid, with multiple secondary electron beams emitted from a surface of a target object on a stage, detecting a plurality of beams including a corner beam located at a corner in the multiple secondary electron beams by the multi-detector, calculating a positional relationship between the plurality of beams including the corner beam and a plurality of second detection elements, which have detected the plurality of beams including the corner beam, in the plurality of first detection elements, calculating, based on the positional relationship, a shift amount for aligning the plurality of first detection elements with the multiple secondary electron beams, and moving, using the shift amount, the multi-detector relatively to the multiple secondary electron beams.

    MULTIPLE ELECTRON BEAM IMAGE ACQUISITION METHOD, MULTIPLE ELECTRON BEAM IMAGE ACQUISITION APPARATUS, AND MULTIPLE ELECTRON BEAM INSPECTION APPARATUS

    公开(公告)号:US20220336183A1

    公开(公告)日:2022-10-20

    申请号:US17655661

    申请日:2022-03-21

    Abstract: A multiple electron beam image acquisition method includes performing scanning with a representative secondary electron beam emitted, based on temporary secondary electron beam deflection conditions, for each of plural positions in a primary electron beam deflection range of a representative primary electron beam, acquiring plural coordinates corresponding to the plural positions, based on detected images of the representative secondary electron beam, each detected at any one of the plural positions in the primary electron beam deflection range of the representative primary electron beam, and calculating, using the plural coordinates acquired, secondary electron beam deflection conditions to cancel movement of the representative secondary electron beam due to movement of the representative primary electron beam in the primary electron beam deflection range of the representative primary electron beam and to fix the irradiation position of the representative secondary electron beam to the predetermined detection element.

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