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公开(公告)号：US11824071B2
公开(公告)日：2023-11-21
申请号：US17678347
申请日：2022-02-23
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC分类号： H01L27/146 , H04N23/00 , H04N23/54 , H04N23/57 , H01L23/00
CPC分类号： H01L27/14618 , H01L23/562 , H01L24/48 , H01L27/1469 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H04N23/00 , H04N23/54 , H04N23/57 , H01L24/45 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/45139 , H01L2924/00014 , H01L2224/45144 , H01L2924/00014 , H01L2224/45147 , H01L2924/00014
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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2.发明授权公开(公告)号：US11758253B2
公开(公告)日：2023-09-12
申请号：US17043381
申请日：2019-04-12
发明人： Bojie Zhao , Dongli Yuan , Zhen Huang , QiMin Mei , Zhenyu Chen
摘要： This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.
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公开(公告)号：US11223751B2
公开(公告)日：2022-01-11
申请号：US16747455
申请日：2020-01-20
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US20200084349A1
公开(公告)日：2020-03-12
申请号：US16547537
申请日：2019-08-21
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US10321028B2
公开(公告)日：2019-06-11
申请号：US15473565
申请日：2017-03-29
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US20170280027A1
公开(公告)日：2017-09-28
申请号：US15093704
申请日：2016-04-07
发明人： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Nan Guo
CPC分类号： H04N5/2257 , H01L27/14618 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H05K3/284 , H05K2201/10151 , H05K2203/1316 , H01L2924/00014
摘要： A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
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公开(公告)号：US11877044B2
公开(公告)日：2024-01-16
申请号：US15999858
申请日：2016-07-28
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Zhen Huang , Feifan Chen , Liang Ding
CPC分类号： H04N23/57 , H04N23/55 , G06F1/1686 , H04N23/67
摘要： A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.
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公开(公告)号：US11729483B2
公开(公告)日：2023-08-15
申请号：US17829721
申请日：2022-06-01
发明人： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0274 , H05K2201/10121
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US11706514B2
公开(公告)日：2023-07-18
申请号：US17983592
申请日：2022-11-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US11412117B2
公开(公告)日：2022-08-09
申请号：US17195816
申请日：2021-03-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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