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公开(公告)号：US20200084349A1
公开(公告)日：2020-03-12
申请号：US16547537
申请日：2019-08-21
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US11706514B2
公开(公告)日：2023-07-18
申请号：US17983592
申请日：2022-11-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US11412117B2
公开(公告)日：2022-08-09
申请号：US17195816
申请日：2021-03-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US12081849B2
公开(公告)日：2024-09-03
申请号：US17635121
申请日：2020-07-08
发明人： Zhongyu Luan , Zhen Huang , Li Liu , Hongfeng Gan , Tinghua Li , Xinxiang Sun
CPC分类号： H04N23/54 , H04N23/55 , H04N23/57 , H05K1/181 , H05K3/303 , H05K2201/10151 , H05K2203/1316
摘要： The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.
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公开(公告)号：US11758255B2
公开(公告)日：2023-09-12
申请号：US17750743
申请日：2022-05-23
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US11412116B2
公开(公告)日：2022-08-09
申请号：US17195785
申请日：2021-03-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US10986257B2
公开(公告)日：2021-04-20
申请号：US16547537
申请日：2019-08-21
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US12003838B2
公开(公告)日：2024-06-04
申请号：US18203731
申请日：2023-05-31
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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