Abstract:
The fabrication process of a conventional MRAM using a magnetoresistive effect element as a memory device is difficult, and the device structure makes it difficult to decrease the cell area and increase the degree of integration. It is an object of this invention to realize an MRAM which can achieve a high integration degree. A memory device is characterized by including a magnetoresistive element, a bit line formed above this magnetoresistive element, and a write line. The magnetoresistive element is formed immediately above the drain region of a field-effect transistor.
Abstract:
TMR elements in a magnetic memory device are formed to be flat to enable their stable operations. A TMR element is formed by putting a tunnel barrier layer being a non-magnetic layer between an upper magnetic layer and a lower magnetic layer, both having a perpendicular magnetic anisotropy. A conductive local connect elongating in a plane is formed on a second plug formed in a contact hole formed in a second and a third inter-layer insulating films. The TMR element is formed on the local connect at a position avoiding a position right above the second plug. The TMR element is connected with the upper surface of the second plug through the local connect. A bit line through which an electric current for applying a magnetic field to the TMR element flows is formed at a position shifted from a position right above the TMR element in a plane.
Abstract:
In a resonance tag provided with a resonance circuit composed of a capacitive element and an inductive element, the capacitive element is characterized by having a condition under which the capacitance of the capacitive element is reversibly changed by a voltage applied to the resonance circuit and anther condition under which the capacitance of the capacitive element is irreversibly changed by another voltage applied to the resonance circuit.
Abstract:
An Si oxide film, an oriented paraelectric oxide thin film and an oriented ferroelectric thin film are laminated on an Si single crystal substrate having a region for a source and a drain. A conductor thin film is formed in a portion not covered with an insulating film. A laminated structure formed of the Si oxide film, the oriented paraelectric oxide thin film and the oriented ferroelectric thin film is used as a gate of a transistor. The Si oxide film functions as a carrier injection inhibiting layer.
Abstract:
A temperature-history sensor includes a resonance circuit composed of at least a capacitor and a coil. The temperature-history sensor has a display for indicating a predetermined set temperature of the temperature-history sensor. The capacitor has at least a thermofusion material between electrodes of the capacitor, and the melting point of the thermofusion material is in the region of the set temperature.
Abstract:
An active-matrix display includes a data line, at least one select line, a control unit supplying a voltage signal and a current signal to the data line, and a pixel circuit receiving the voltage signal and the current signal from the data line to drive a light emitting element, the control unit including a voltage or first current source supplying a voltage or current pulse to the data line in order to make the voltage holding unit hold the voltage signal for making the light emitting element emit light having predetermined brightness in a first selection period in which the first switch is closed, a second current source supplying the current signal for making the light emitting element emit light having the predetermined brightness to the data line in a second selection period in which the first switch and the second switch are closed, a detection circuit detecting potential held in the voltage holding unit in the second selection period, and a correction unit correcting the voltage signal based on a relationship between the current signal and the detected potential.
Abstract:
A temperature-history sensor includes a resonance circuit composed of at least a capacitor and a coil. The temperature-history sensor has a display for indicating a predetermined set temperature of the temperature-history sensor. The capacitor has at least a thermofusion material between electrodes of the capacitor, and the melting point of the thermofusion material is in the region of the set temperature.
Abstract:
The present invention provides a light emitting element circuit that includes a current mirror circuit which includes two thin film transistors, two current input terminals and two output terminals, a capacitor for holding voltage corresponding to an electric current to be input from one of the two current input terminals, and a light emitting element connected to the current mirror circuit, and that supplies an electric current in accordance with the voltage held in the capacitor to the light emitting element through the current mirror circuit, wherein the two output terminals of the current mirror circuit are connected to the light emitting element, and the two current input terminals of the current mirror circuit are connected with each other through a switch in a time period other than a time period during which an electric current is input from the one of the two current input terminals.
Abstract:
One main electrode of a TFT is connected with one terminal of a two-terminal type nonvolatile memory element, a gate electrode of the TFT is connected with a word line, and the other main electrode thereof is connected with a bit line. The other terminal of the memory element is connected with a base line. A fixed resistor is connected between a connecting point between the other main electrode of the TFT and the bit line and an input terminal of the bit line. In information writing for changing the memory element whose initial state is a low impedance state to a high impedance state, voltages having polarities reverse relative to a reference voltage are applied to the input terminal of the bit line and an input terminal of the base line, respectively, so that a high voltage necessary to change the state is applied between both the terminals of the memory element.
Abstract:
An unauthorized access prevention method is provided for an integrated circuit including one or plural resistor elements capable of selecting between a high impedance state and a low impedance state irreversibly in an interface portion within the integrated circuit or a peripheral circuit portion. When a signal inconsistent with verification information and standard that are preset in the integrated circuit is received at least once, the impedance state of the resistor element is changed from an initial state to stop a part or all of accesses to the integrated circuit irreversibly. The unauthorized access prevention method is thus implemented by a simple structure manufactured with ease and at low cost.