公开(公告)号：US20250096077A1

公开(公告)日：2025-03-20

申请号：US18468958

申请日：2023-09-18

Applicant: NXP B.V.

Inventor： Yen-Chih Lin ,  Yao Jung Chang ,  Kuan Lin Huang ,  Yi-Hsuan Tsai ,  Meng-huang Sie

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A method of forming a semiconductor device is provided. The method includes mounting a semiconductor die on a die pad of a leadframe. The die pad includes a central opening configured to expose a central portion of the semiconductor die. A first end of a bond wire is attached to a bond pad of the semiconductor die and a second end of the bond wire is attached to a lead of the leadframe. An encapsulant encapsulates the semiconductor die and the leadframe. A portion of the lead and a portion of the die pad are exposed and protruded through the encapsulant.

公开(公告)号：US20240038683A1

公开(公告)日：2024-02-01

申请号：US17815638

申请日：2022-07-28

Applicant: NXP B.V.

Inventor： Tzu Ya Fang ,  Yen-Chih Lin ,  Jian Nian Chen ,  Moly Lee ,  Yi Xiu Xie ,  Vanessa Wyn Jean Tan ,  Yao Jung Chang ,  Yi-Hsuan Tsai ,  Xiu Hong Shen ,  Kuan Lin Huang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L25/0657 ,  H01L24/20 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2224/214 ,  H01L2924/17151 ,  H01L2924/351 ,  H01L2221/68372

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.

公开(公告)号：US20220399234A1

公开(公告)日：2022-12-15

申请号：US17347843

申请日：2021-06-15

Applicant: NXP B.V.

Inventor： WeiCheng Chuang ,  PaoTung Pan ,  Che Lun Cheng ,  Yao Jung Chang ,  Yu-Wen Chu ,  Chun-Hui Lee ,  Che-Kai Hsu ,  Kuan Lin Huang

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/683 ,  H01L23/544 ,  H01L23/00 ,  H01L23/58

Abstract: A method of semiconductor die singulation is provided. The method includes forming a first trench along a singulation lane of a semiconductor wafer. A second trench is formed extending from a bottom of the first trench. A portion of the semiconductor wafer remains between a bottom of the second trench and a backside of the semiconductor wafer. A cut is formed by way of a laser to singulate die of the semiconductor wafer. The cut extends through the portion of the semiconductor wafer remaining between the bottom of the second trench and the backside of the semiconductor wafer.