公开(公告)号：US20240038683A1

公开(公告)日：2024-02-01

申请号：US17815638

申请日：2022-07-28

申请人： NXP B.V.

发明人： Tzu Ya Fang ,  Yen-Chih Lin ,  Jian Nian Chen ,  Moly Lee ,  Yi Xiu Xie ,  Vanessa Wyn Jean Tan ,  Yao Jung Chang ,  Yi-Hsuan Tsai ,  Xiu Hong Shen ,  Kuan Lin Huang

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

CPC分类号： H01L23/562 ,  H01L25/0657 ,  H01L24/20 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2224/214 ,  H01L2924/17151 ,  H01L2924/351 ,  H01L2221/68372

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.