公开(公告)号：US20250096077A1

公开(公告)日：2025-03-20

申请号：US18468958

申请日：2023-09-18

Applicant: NXP B.V.

Inventor： Yen-Chih Lin ,  Yao Jung Chang ,  Kuan Lin Huang ,  Yi-Hsuan Tsai ,  Meng-huang Sie

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A method of forming a semiconductor device is provided. The method includes mounting a semiconductor die on a die pad of a leadframe. The die pad includes a central opening configured to expose a central portion of the semiconductor die. A first end of a bond wire is attached to a bond pad of the semiconductor die and a second end of the bond wire is attached to a lead of the leadframe. An encapsulant encapsulates the semiconductor die and the leadframe. A portion of the lead and a portion of the die pad are exposed and protruded through the encapsulant.