公开(公告)号：US09257374B1

公开(公告)日：2016-02-09

申请号：US14582521

申请日：2014-12-24

Applicant: NXP B.V.

Inventor： Chanon Suwankasab ,  Amornthep Saiyajiatara

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49555 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83464 ,  H01L2224/83856 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Consistent with an example embodiment, a thin outline shrink package (TSOP) provides for a significant reduction in lead pitch along with a reduced package profile for a semiconductor device die packaged, therein.

Abstract translation: 与示例性实施例一致，薄外形收缩封装（TSOP）提供了引线间距的显着降低以及其中封装的半导体器件封装的减小的封装形状。