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公开(公告)号：US11893917B2
公开(公告)日：2024-02-06
申请号：US18016007
申请日：2021-06-22
Applicant: Nokia Technologies Oy
Inventor： Nicholas Jeffers , Ian Davis , Akshat Agarwal , Diarmuid O'Connell , Oliver Burns
CPC classification number: G09G3/03 , G06F1/1616 , G06F1/1647 , G09G3/06 , G09G2310/02 , G09G2320/0626
Abstract: An apparatus and method is provided including: modulating or modifying light output by one or more light sources, wherein the light output is for use in rendering content in a first direction using a display, wherein the display has at least one curved portion, wherein the modulating or modifying of the light output by the one or more light sources modulates or modifies said light within said at least one curved portion such that said content is rendered in the first direction.
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公开(公告)号：US10924866B2
公开(公告)日：2021-02-16
申请号：US16287338
申请日：2019-02-27
Applicant: Nokia Technologies Oy
Inventor： Ian Davis , Akshat Agarwal
Abstract: An apparatus including a first member; a first array of flexible actuators connected to the first member, where each of the flexible actuators includes a piezoelectric member and an extension on the piezoelectric member; and a first flexible membrane connected to the first array of flexible actuators. Each of the piezoelectric members is configured to be activated to move their respective extensions. Each of the extensions, when moved by their respective piezoelectric members, is configured to move the first flexible membrane.
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公开(公告)号：US11680886B2
公开(公告)日：2023-06-20
申请号：US16767835
申请日：2018-12-10
Applicant: Nokia Technologies Oy
Inventor： Akshat Agarwal , Nicholas Jeffers
CPC classification number: G01N15/0656 , G01N15/1218 , G01N2015/0046
Abstract: An apparatus comprising: a body having an aperture dimensioned to receive an air-borne particle of corresponding size; first and second electrodes positioned within the aperture between which a potential difference can be applied; and a measurement circuit configured to measure an electrical property between the first and second electrodes such that the presence of the air-borne particle within the aperture can be detected based on a change in the electrical property when the air-borne particle contacts both the first and second electrodes.
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4.发明授权公开(公告)号：US10770862B2
公开(公告)日：2020-09-08
申请号：US16123400
申请日：2018-09-06
Applicant: Nokia Technologies Oy
Inventor： Rudi O'Reilly Meehan , Akshat Agarwal , Nicholas M. Jeffers
Abstract: There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.
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公开(公告)号：US20200229801A1
公开(公告)日：2020-07-23
申请号：US16743246
申请日：2020-01-15
Applicant: Nokia Technologies Oy
Inventor： Akshat Agarwal , Diarmuid O'Connell
Abstract: Examples of the disclosure relate to an apparatus for sensing biometric parameters. The apparatus may comprise heat transfer means configured to transfer heat from a first location to a location proximate to a subject's sweat glands. The apparatus may also comprise sweat transfer means configured to transfer sweat from the location proximate to a subject's sweat glands to one or more sensors wherein the one or more sensors are configured to sense one or more biometric parameters from the subject's sweat.
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Patent Agency Ranking
公开(公告)号：US10575098B2
公开(公告)日：2020-02-25
申请号：US15895382
申请日：2018-02-13
Applicant: NOKIA TECHNOLOGIES OY
Inventor： Ian Davis , Rudi O'Reilly Meehan , Akshat Agarwal
Abstract: A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.
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7.发明授权公开(公告)号：US12082372B2
公开(公告)日：2024-09-03
申请号：US17364339
申请日：2021-06-30
Applicant: Nokia Technologies Oy
Inventor： Akshat Agarwal , Ian Davis , Nicholas Jeffers , Diarmuid O'Connell , Oliver Burns
CPC classification number: H05K7/2029 , H05K7/20281 , H05K7/20381 , H05K7/2039 , H02J7/02 , H02J50/10 , H02J50/40
Abstract: Methods, apparatuses, and computer program products are disclosed for providing a multiphase pumping mechanism configured for multiphase cooling of electrical charging circuitry. In the context of an apparatus, the apparatus includes a thermoelectric cooling device having first and second opposed surfaces and a fluid circulation path having first and second branches in thermal communication with the first and second surfaces, respectively, of the thermoelectric cooling device. The fluid circulation path is configured to control flow of fluid therethrough such that the fluid alternately flows through the first and second branches. The first branch of the fluid circulation path is also configured to be in a thermal communication with at least one first component of a mobile electronic device in order to absorb heat and correspondingly cool the at least one first component of the mobile electronic device.
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公开(公告)号：US11862390B2
公开(公告)日：2024-01-02
申请号：US17324642
申请日：2021-05-19
Applicant: Nokia Technologies Oy
Inventor： Diarmuid O'Connell , Akshat Agarwal , Ian Davis , Nicholas Jeffers
CPC classification number: H01F38/14 , G05D7/0106 , H01F27/085 , H01F27/366 , H02J7/0044
Abstract: A charging apparatus for inductive charging. The charging apparatus comprises one or more charging coils configured to transfer power to a mobile apparatus and at least one flexible diaphragm configured so that movement of the flexible diaphragm directs air flow towards the mobile apparatus. At least one of, the one or more charging coils or actuating circuitry for actuating the one or more charging coils are mounted on the flexible diaphragm.
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公开(公告)号：US20220087066A1
公开(公告)日：2022-03-17
申请号：US17407368
申请日：2021-08-20
Applicant: Nokia Technologies Oy
Inventor： Nick Jeffers , Diarmuid O'Connell , Ian Davis , Akshat Agarwal , Ollie Burns
Abstract: According to examples of the disclosure there is provided a vapour chamber comprising one or more ducts extending between a condenser and an evaporator. Powder can be provided within the one or more ducts wherein the powder is configured to control flow of a working fluid through the one or more ducts.
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10.发明申请公开(公告)号：US20220015259A1
公开(公告)日：2022-01-13
申请号：US17364339
申请日：2021-06-30
Applicant: Nokia Technologies Oy
Inventor： Akshat Agarwal , Ian Davis , Nicholas Jeffers , Diarmuid O'Connell , Oliver Burns
IPC: H05K7/20
Abstract: Methods, apparatuses, and computer program products are disclosed for providing a multiphase pumping mechanism configured for multiphase cooling of electrical charging circuitry. In the context of an apparatus, the apparatus includes a thermoelectric cooling device having first and second opposed surfaces and a fluid circulation path having first and second branches in thermal communication with the first and second surfaces, respectively, of the thermoelectric cooling device. The fluid circulation path is configured to control flow of fluid therethrough such that the fluid alternately flows through the first and second branches. The first branch of the fluid circulation path is also configured to be in a thermal communication with at least one first component of a mobile electronic device in order to absorb heat and correspondingly cool the at least one first component of the mobile electronic device.
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