METHOD, APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR MULTIPHASE COOLING OF A MOBILE ELECTRONIC DEVICE

    公开(公告)号:US20220015259A1

    公开(公告)日:2022-01-13

    申请号:US17364339

    申请日:2021-06-30

    Abstract: Methods, apparatuses, and computer program products are disclosed for providing a multiphase pumping mechanism configured for multiphase cooling of electrical charging circuitry. In the context of an apparatus, the apparatus includes a thermoelectric cooling device having first and second opposed surfaces and a fluid circulation path having first and second branches in thermal communication with the first and second surfaces, respectively, of the thermoelectric cooling device. The fluid circulation path is configured to control flow of fluid therethrough such that the fluid alternately flows through the first and second branches. The first branch of the fluid circulation path is also configured to be in a thermal communication with at least one first component of a mobile electronic device in order to absorb heat and correspondingly cool the at least one first component of the mobile electronic device.

    Tuning radio frequency elements
    6.
    发明授权

    公开(公告)号:US12272961B2

    公开(公告)日:2025-04-08

    申请号:US17321762

    申请日:2021-05-17

    Abstract: Aspects of the present disclosure may relate to an apparatus, a method, and non-transitory computer-readable storage medium configured for tuning radio frequency elements. In some aspects, the aspects may relate to at least one radio frequency element, at least one wireless charging, one or more channels configured to run between a first portion at least substantially adjacent to the at least one wireless charging coil and a second portion at least substantially adjacent to the at least one radio frequency element, and a dielectric fluid disposed within the one or more channels.

    Heat transfer apparatus
    8.
    发明授权

    公开(公告)号:US11122706B2

    公开(公告)日:2021-09-14

    申请号:US16441730

    申请日:2019-06-14

    Inventor: Nicholas Jeffers

    Abstract: A heat transfer apparatus and method of manufacture is disclosed. The manifold may have a first mechanical interface, a second mechanical interface remote from the first mechanical interface and one or more internal walls defining at least first and second channels within the manifold between the first and second mechanical interfaces. An evaporator member may be attached to the manifold so as to seal the first mechanical interface. A condenser member may be attached to the manifold so as to seal the second mechanical interface. The manifold, evaporator and condenser members may provide a contained heat transfer system in which a working fluid moves between the condenser member and the evaporator member.

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