公开(公告)号：US10770862B2

公开(公告)日：2020-09-08

申请号：US16123400

申请日：2018-09-06

Applicant: Nokia Technologies Oy

Inventor： Rudi O'Reilly Meehan ,  Akshat Agarwal ,  Nicholas M. Jeffers

IPC: H01S5/024 ,  H01L33/64 ,  H01L25/16 ,  B33Y80/00

Abstract: There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.

公开(公告)号：US11060927B2

公开(公告)日：2021-07-13

申请号：US16606007

申请日：2018-04-20

Applicant: Nokia Technologies Oy

Inventor： Diarmuid O'Connell ,  Nicholas M. Jeffers ,  Oliver Burns

IPC: G01L1/18

Abstract: A strain sensor includes a viscous piezoresistive element embedded or encapsulated within a solid, flexible, resilient packaging element, and a contact contactable from the exterior of the strain sensor and defining an electrical path through or along at least a portion of the viscous piezoresistive element, the resistance of the electrical path varying with deformation of the strain sensor. The invention allows the high gauge factor of a viscous piezoresistive material to be taken advantage of in a practical device by containing the material within a packaging element. The packaging element ensures a consistent output response as a function of deformation of the strain sensor and enables the strain sensor to detect time-varying forces due to the resilient nature of the packaging element.

公开(公告)号：US20190081453A1

公开(公告)日：2019-03-14

申请号：US16123400

申请日：2018-09-06

Applicant: Nokia Technologies Oy

Inventor： Rudi O'Reilly Meehan ,  Akshat Agarwal ,  Nicholas M. Jeffers

IPC: H01S5/024

Abstract: There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.