A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.