公开(公告)号：US11693456B2

公开(公告)日：2023-07-04

申请号：US17383841

申请日：2021-07-23

Applicant: Nokia Technologies Oy

Inventor： Nick Jeffers ,  Diarmuid O'Connell ,  Ian Davis ,  Akshat Agarwal ,  Oliver Burns

IPC: G06F1/16 ,  G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: G06F1/1681 ,  G06F1/203 ,  G06F1/206 ,  H01L23/427 ,  H05K7/20336 ,  G06F2200/201 ,  G06F2200/203

Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

公开(公告)号：US20220087066A1

公开(公告)日：2022-03-17

申请号：US17407368

申请日：2021-08-20

Applicant: Nokia Technologies Oy

Inventor： Nick Jeffers ,  Diarmuid O'Connell ,  Ian Davis ,  Akshat Agarwal ,  Ollie Burns

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04

Abstract: According to examples of the disclosure there is provided a vapour chamber comprising one or more ducts extending between a condenser and an evaporator. Powder can be provided within the one or more ducts wherein the powder is configured to control flow of a working fluid through the one or more ducts.