公开(公告)号：US09955579B2

公开(公告)日：2018-04-24

申请号：US15057518

申请日：2016-03-01

Applicant: Nitto Denko Corporation

Inventor： Hiroyuki Tanabe ,  Daisuke Yamauchi

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K3/38 ,  G11B5/48 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/11 ,  G11B5/484 ,  H05K1/0242 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/181 ,  H05K3/285 ,  H05K3/384 ,  H05K3/40 ,  H05K2201/0154 ,  H05K2201/09081 ,  H05K2201/10931 ,  H05K2203/072

Abstract: A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.

公开(公告)号：US10327327B2

公开(公告)日：2019-06-18

申请号：US15696270

申请日：2017-09-06

Applicant: Nitto Denko Corporation

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/46 ,  G11B5/48 ,  H05K3/40 ,  H05K1/09 ,  H05K1/03

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

公开(公告)号：US10028378B2

公开(公告)日：2018-07-17

申请号：US15373573

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Naohiro Terada ,  Yuu Sugimoto ,  Daisuke Yamauchi

IPC: H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44 ,  H05K1/02 ,  H05K1/03

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US10524355B2

公开(公告)日：2019-12-31

申请号：US15488808

申请日：2017-04-17

Applicant: Nitto Denko Corporation

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/46

Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

公开(公告)号：US10074389B2

公开(公告)日：2018-09-11

申请号：US15800692

申请日：2017-11-01

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: G11B5/48 ,  H05K1/02

CPC classification number: G11B5/486 ,  G11B5/484 ,  H05K1/0242 ,  H05K1/028 ,  H05K2201/09236

Abstract: A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.

公开(公告)号：US10021780B2

公开(公告)日：2018-07-10

申请号：US15800680

申请日：2017-11-01

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/06 ,  H05K3/18

CPC classification number: H05K1/028 ,  G11B5/484 ,  H05K1/056 ,  H05K3/064 ,  H05K3/18 ,  H05K3/243 ,  H05K2201/0191 ,  H05K2201/0347 ,  H05K2201/09736 ,  H05K2203/0353

Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

公开(公告)号：US09949370B2

公开(公告)日：2018-04-17

申请号：US15373583

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Naohiro Terada ,  Yuu Sugimoto ,  Daisuke Yamauchi

IPC: H05K1/03 ,  H05K1/05 ,  H05K3/22 ,  H05K3/46 ,  G11B5/48 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/05 ,  G11B5/483 ,  G11B5/4853 ,  H05K1/117 ,  H05K3/22 ,  H05K3/3442 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10151 ,  H05K2201/10227 ,  Y02P70/613

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

公开(公告)号：US09940957B2

公开(公告)日：2018-04-10

申请号：US15223241

申请日：2016-07-29

Applicant: Nitto Denko Corporation

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: H05K1/09 ,  H05K1/05 ,  G11B5/48 ,  H05K1/11 ,  H05K3/24 ,  H05K3/38

CPC classification number: G11B5/4833 ,  G11B5/484 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/05 ,  Y02P70/611

Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.

公开(公告)号：US10225930B2

公开(公告)日：2019-03-05

申请号：US14753433

申请日：2015-06-29

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke Yamauchi ,  Takatoshi Sakakura

IPC: G11B5/127 ,  H04R31/00 ,  H05K1/05 ,  H05K3/00 ,  H05K3/02 ,  H05K3/44 ,  G11B5/48 ,  H05K3/06

Abstract: A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer, forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

公开(公告)号：US10154579B2

公开(公告)日：2018-12-11

申请号：US15597686

申请日：2017-05-17

Applicant: Nitto Denko Corporation

Inventor： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K3/46 ,  H05K1/11 ,  G11B5/48 ,  H05K1/18

Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.