Abstract:
This invention relates to a novel polyimide silicone having an alcoholic hydroxyl group and a process for the preparation thereof. The polyimide of the invention having a primary alcoholic hydroxyl group is represented by the following general formula (1), wherein X represents a tetravalent organic group, Y represents a divalent group having at least one monovalent group selected from the group consisting of a phenolic hydroxyl group and a carboxyl group, with at least one being a divalent organic group having an alcoholic hydroxyl group, Z represents a divalent organic group, W represents a divalent organic group having an organosiloxane structure, k is a positive number, and each of m and n is equal to 0 (zero) or a positive number, with 0.1≦k/(k+m+n)≦1, 0≦m/(k+m+n)≦0.8, 0≦n/(k+m+n)≦0.8.
Abstract translation:本发明涉及具有醇羟基的新型聚酰亚胺硅酮及其制备方法。 具有伯醇羟基的本发明的聚酰亚胺由以下通式(1)表示,其中X表示四价有机基团,Y表示具有至少一个选自酚羟基的一价基团的二价基团 基团和羧基,至少一个是具有醇羟基的二价有机基团,Z表示二价有机基团,W表示具有有机硅氧烷结构的二价有机基团,k表示正数,m和 n等于0(零)或正数,其中具有0.1和nlE; k /(k + m + n)≦̸ 1,0和nlE; m /(k + m + n)≦̸ 0.8,0和nlE; k + m + n)≦̸ 0.8。
Abstract:
A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0
Abstract translation:一种半导体装置粘合剂组合物,当粘合时具有优异的粘合性能,并且当硬化时具有优异的连接可靠性和绝缘可靠性,以及使用该粘合剂组合物的粘合 一种粘合剂组合物,其包含:(A)由以下通式(1)表示的重复单元构成的有机硅树脂; (B)热固性树脂; 和(C)具有助焊剂活性的化合物,其中R 1至R 4表示碳数为1至8的一价烃基,它们彼此相同或不同; 1和m各自为1至100的整数; a,b,c和d中的每一个为0或正数,满足0 <(c + d)/(a + b + c + d) 并且X和Y各自为二价有机基团。
Abstract:
The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.
Abstract:
A polyimide silicone resin, characterized in that the polyimide silicone resin comprises repeating units represented by the following formula (1) and has a number average molecular weight of from 5,000 to 200,000 wherein X is a tetravalent organic group, at least one of the tetravalent organic groups being represented by the following formula (2) wherein R1 may be the same with or different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R2may be the same with or different from each other and is a trivalent organic group, and n ranges from 1 to 120 on average, and Y is a divalent organic group, at least one of the divalent organic groups comprising a phenolic hydroxyl group or a carboxyl group bonded to an aromatic ring.
Abstract:
The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.
Abstract:
The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D).
Abstract:
Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.
Abstract:
A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.
Abstract:
Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.
Abstract:
A polyimide resin having a number average molecular weight of from 2,000 to 800,000 and a repeating unit represented by the following formula (1): wherein X is a tetravalent organic group, Y is a divalent organic group, 75 to 98 mole % of R1 is hydrogen atom, and 2 to 25 mole % of R1 is 1,2-naphthoquinonediazide sulfonyl group.