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公开(公告)号：US06911265B2
公开(公告)日：2005-06-28
申请号：US10169327
申请日：2001-10-26
IPC分类号： B32B15/08 , B32B27/34 , H05K1/03 , H05K3/02 , H05K3/14 , H05K3/18 , H05K3/38 , H05K3/46 , B32B7/12
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
摘要翻译： 本发明提供了一种用于印刷布线基板和多层印刷布线板的层压板，其具有高耐热性，窄间距布线图案，具有小直径的通孔，具有均匀厚度的绝缘层和金属层与 合成树脂膜，有助于电子设备的小型化，高性能和功能改进。 本发明涉及一种金属层压体，其包括层压在合成树脂膜的一面或两面上的金属层，其中该金属层是厚度至多为5um的金属箔。 本发明还涉及一种层压体，其包括在合成树脂膜的一面或两面上具有至多5um厚度的金属层，其中所述合成树脂膜是通过将部分酰亚胺化或部分干燥的聚 （酰胺酸）膜在含有选自铝，硅，钛，锰，铁，钴，铜，锌，锡，锑，铅，铋和钯中的至少一种元素的化合物的溶液中，或通过应用 对该膜的溶液，然后完全干燥和酰亚胺化聚（酰胺酸）膜，所得聚酰亚胺膜含有至少一种元素。
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公开(公告)号：US07101619B2
公开(公告)日：2006-09-05
申请号：US11134655
申请日：2005-05-20
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
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3.发明授权公开(公告)号：US08313831B2
公开(公告)日：2012-11-20
申请号：US10537959
申请日：2003-12-12
IPC分类号： B32B27/00
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译： 本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该树脂膜的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2比为0.4的层叠体 至1，Ra2是以0.1mm的截止值测量的值。 这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。
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4.发明申请公开(公告)号：US20060115670A1
公开(公告)日：2006-06-01
申请号：US10537959
申请日：2003-12-12
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译： 本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该表面的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2的比例为0.4 至1，Ra2是以0.1mm的截止值测量的值。 这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。
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公开(公告)号：US07115681B2
公开(公告)日：2006-10-03
申请号：US10482897
申请日：2002-07-08
IPC分类号： C08L79/08
CPC分类号： H05K1/0346 , C08G59/08 , C08G59/5033 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22
摘要： The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
摘要翻译： 本发明提供一种包含含有特定二酐和二胺的聚酰亚胺和环氧树脂的树脂组合物。 树脂组合物可以在相对较低的温度下结合，具有优异的耐热性，粘附性，耐焊接性和PCT后剥离强度的保持率。 通过使用包含该树脂组合物的金属箔的聚酰亚胺树脂片或聚酰亚胺树脂片根据半添加方法形成具有良好布线形状，电路牢固牢固和绝缘电阻高的印刷线路板的电路 在微电路空间可以获得。
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公开(公告)号：US20050221080A1
公开(公告)日：2005-10-06
申请号：US11134655
申请日：2005-05-20
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.
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7.发明授权Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same 失效包含聚酰亚胺和导体层的层压板，使用其的多层布线板及其制造方法公开(公告)号：US07662429B2
公开(公告)日：2010-02-16
申请号：US09782169
申请日：2001-02-14
申请人： Shoji Hara , Takashi Itoh , Hitoshi Nojiri , Masaru Nishinaka
发明人： Shoji Hara , Takashi Itoh , Hitoshi Nojiri , Masaru Nishinaka
CPC分类号： B32B27/34 , H05K1/0346 , H05K3/022 , Y10T428/24917 , Y10T428/31681
摘要： A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.
摘要翻译： 通过加压和加热将通过在热塑性聚酰亚胺的表面上直接形成至少一个导体层而获得的聚酰亚胺和导体层的层压体热熔融，从而提高热塑性聚酰亚胺和导体层之间的粘合强度 。 因此，在不进行任何表面粗糙化处理或使用任何粘合金属层的情况下，可以获得导体层和聚酰亚胺膜之间的粘合强度优异的层叠体。
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公开(公告)号：US07247367B2
公开(公告)日：2007-07-24
申请号：US10467210
申请日：2002-02-20
申请人： Masaru Nishinaka , Takashi Itoh
发明人： Masaru Nishinaka , Takashi Itoh
CPC分类号： C08G73/1007 , B29C41/003 , B29C41/12 , B29K2079/08 , B29K2105/0073 , C09D179/08 , Y10T428/31721
摘要： The polyimide film of the present invention is produced in the following manner: polyamic acid made of a combination of a specific acid anhydride constituent and a specific diamine constituent are heated under a low-pressure circumstance for heat imidation, and the obtained imide is dissolved again in a solvent to be polyimide solution, then the polyimide solution is formed to be a film. In this manner, it is possible to provide a polyimide film essentially transparent and colorless, and has sufficient toughness to prevent occurrences of a crack or a break when the film is folded and creased by hand.
摘要翻译： 本发明的聚酰亚胺膜以下列方式制造：在特定酸酐组分和特定二胺组分的组合下制备的聚酰胺酸在低压环境下加热以进行酰亚胺化，所得酰亚胺再次溶解 在作为聚酰亚胺溶液的溶剂中，将聚酰亚胺溶液形成为膜。 以这种方式，可以提供基本上透明和无色的聚酰亚胺膜，并且当薄膜折叠和折皱时具有足够的韧性以防止裂纹发生或断裂。
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公开(公告)号：US20060048963A1
公开(公告)日：2006-03-09
申请号：US10537838
申请日：2003-12-05
IPC分类号： B32B15/08
CPC分类号： H05K1/0346 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2307/202 , B32B2307/306 , B32B2457/08 , H05K1/036 , H05K3/146 , H05K3/381 , Y10T428/12569 , Y10T428/31681
摘要： A laminate which comprises a thermoplastic polyimide layer and a metal layer, or comprises a non-thermoplastic polyimide film layer and, formed on one or both surfaces, a thermoplastic polyimide layer and a metal layer; and a printed wiring board comprising the laminate. The laminate can be used for forming a high density circuit thereon, exhibits good resistance to further processing such as desmearing and excellent adhesion, and is excellent in adhesion reliability in a high temperature atmosphere.
摘要翻译： 一种层压体，其包含热塑性聚酰亚胺层和金属层，或包含非热塑性聚酰亚胺膜层，并且在一个或两个表面上形成热塑性聚酰亚胺层和金属层; 以及包括层压体的印刷线路板。 该层叠体可用于在其上形成高密度电路，显示出良好的抵抗进一步加工如耐磨和优异的粘合性，并且在高温气氛中的粘合可靠性优异。
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公开(公告)号：US07252881B2
公开(公告)日：2007-08-07
申请号：US10257502
申请日：2001-04-12
申请人： Takashi Itoh , Shoji Hara , Hirosaku Nagano , Masaru Nishinaka
发明人： Takashi Itoh , Shoji Hara , Hirosaku Nagano , Masaru Nishinaka
CPC分类号： H05K3/4655 , B32B27/06 , H05K3/386 , H05K3/388 , H05K3/389 , H05K3/4652 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0358 , H05K2201/068 , H05K2203/121 , Y10T428/24917 , Y10T428/2804 , Y10T428/2848 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.
摘要翻译： 一种多层结构，包括导体层，粘合剂层和介于导体层和粘合剂层之间的聚合物膜层。 多层结构可以用于提供具有优异的电性能和良好的物理平衡性，高耐热性，窄间距布线图案，小直径孔，均匀绝缘层厚度，适当低的系数 线膨胀，金属与聚合物膜之间的粘合性稳定。 聚合物膜层可以在分子中含有至少一个由式（1）表示的重复单元。 本发明还提供从多层结构体获得的多层布线基板。
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