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    Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem
    1.
    发明申请
    Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem 有权
    电镀目标材料，聚酰胺溶液和聚酰亚胺树脂溶液，用于形成电镀靶材和印刷线路板使用THem

    公开(公告)号：US20070264490A1

    公开(公告)日：2007-11-15

    申请号：US11665226

    申请日：2005-10-13

    申请人： Kanji Shimoosako ,  Takashi Ito ,  Shigeru Tanaka ,  Masaru Nishinaka ,  Mutsuaki Murakami

    发明人： Kanji Shimoosako ,  Takashi Ito ,  Shigeru Tanaka ,  Masaru Nishinaka ,  Mutsuaki Murakami

    IPC分类号： C23C18/20

    CPC分类号： C23C18/31 ,  C08G73/10 ,  C23C18/20 ,  C23C18/2033 ,  C23C18/2066 ,  C23C18/38 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/4661 ,  H05K2201/0154 ,  H05K2203/066 ,  H05K2203/0759 ,  Y10S428/901 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31663 ,  Y10T428/31681 ,  Y10T428/31721

    摘要： A plating-target material of the present invention includes a layer-A to be subjected to electroless plating. The surface roughness of the layer-A is such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 μm. The 90° anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin. Further, a plating-target material of the present invention includes the layer-A to be subjected to electroless plating. The layer-A includes a resin, and the sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material of the present invention is suitably applicable to manufacturing of a printed-wiring board or the like. Furthermore, the present invention provides a polyamic acid solution, and a polyimide resin solution for use in the plating-target material, and a printed-wiring board made by using them.

    摘要翻译： 本发明的电镀靶材料包括要进行化学镀的层A。 层A的表面粗糙度使得在0.002mm的截止值处测量的算术平均粗糙度Ra小于0.5μm。 A层的90°抗剥离粘合力为1.0N / 25mm以下。 此外，层A包括聚酰亚胺树脂。 此外，本发明的电镀对象材料包括要进行化学镀的层A。 层A包含树脂，含有A层的片材的伸长率模量为1.8GPa以下。 本发明的电镀对象材料即使表面不粗糙也具有与其表面上形成的化学镀膜的高粘合性，并且可以在整个表面上有利地形成化学镀。 因此，本发明的电镀靶材料适用于印刷电路板等的制造。 此外，本发明提供了一种聚酰胺酸溶液和用于电镀靶材料的聚酰亚胺树脂溶液和使用它们制成的印刷电路板。

    Polyimide film and process for producing the same
    2.
    发明授权
    Polyimide film and process for producing the same 有权
    聚酰亚胺膜及其制造方法

    公开(公告)号：US07247367B2

    公开(公告)日：2007-07-24

    申请号：US10467210

    申请日：2002-02-20

    申请人： Masaru Nishinaka ,  Takashi Itoh

    发明人： Masaru Nishinaka ,  Takashi Itoh

    IPC分类号： B32B27/32 ,  B32B27/00 ,  C08G69/26

    CPC分类号： C08G73/1007 ,  B29C41/003 ,  B29C41/12 ,  B29K2079/08 ,  B29K2105/0073 ,  C09D179/08 ,  Y10T428/31721

    摘要： The polyimide film of the present invention is produced in the following manner: polyamic acid made of a combination of a specific acid anhydride constituent and a specific diamine constituent are heated under a low-pressure circumstance for heat imidation, and the obtained imide is dissolved again in a solvent to be polyimide solution, then the polyimide solution is formed to be a film. In this manner, it is possible to provide a polyimide film essentially transparent and colorless, and has sufficient toughness to prevent occurrences of a crack or a break when the film is folded and creased by hand.

    摘要翻译： 本发明的聚酰亚胺膜以下列方式制造：在特定酸酐组分和特定二胺组分的组合下制备的聚酰胺酸在低压环境下加热以进行酰亚胺化，所得酰亚胺再次溶解 在作为聚酰亚胺溶液的溶剂中，将聚酰亚胺溶液形成为膜。 以这种方式，可以提供基本上透明和无色的聚酰亚胺膜，并且当薄膜折叠和折皱时具有足够的韧性以防止裂纹发生或断裂。

    Polyimide film, process for preparing the same and controlling isotropy of the same
    3.
    发明申请
    Polyimide film, process for preparing the same and controlling isotropy of the same 审中-公开
    聚酰亚胺膜，其制备方法及其各向同性的控制

    公开(公告)号：US20060138707A1

    公开(公告)日：2006-06-29

    申请号：US11357275

    申请日：2006-02-17

    申请人： Hidehito Nishimura ,  Kazuhiro Ono ,  Masaru Nishinaka ,  Kiyokazu Akahori

    发明人： Hidehito Nishimura ,  Kazuhiro Ono ,  Masaru Nishinaka ,  Kiyokazu Akahori

    IPC分类号： B29C71/00

    CPC分类号： C08J5/18 ,  B29C71/02 ,  B29C2071/0027 ,  B29K2079/08 ,  B29L2007/008 ,  C08J2379/08

    摘要： To provide a polyimide film having an original film width of at least 500 mm, whose isotropy in a width direction is improved to have uniform properties, which polyimide film has been apt to cause property difference in the width direction by continuous molding. The polyimide film has an original film width of at least 500 mm and a thickness of at most 50 μm, wherein the maximum value of MOR-c is at most 1.35 and a tensile elastic modulus is at least 5.0 GPa at any part of the film. The polyimide film is prepared by the method which comprises steps of: forming a green sheet containing a volatile component, and heating the green sheet by transferring the same through a furnace with both ends of the green sheet being fixed, wherein at the heating step, the original film has an orientation axis angle θ of a positive value at both ends in the original film width direction, and temperature is lower than the boiling point of a main volatile component in a zone where the original film is transferred for a distance equal to the film width between both fixed ends.

    摘要翻译： 为了提供具有至少500mm的原始膜宽度的聚酰亚胺膜，其在宽度方向上的各向同性被改善以具有均匀的性质，该聚酰亚胺膜已经通过连续成型容易导致宽度方向上的性能差异。 聚酰亚胺薄膜的原始薄膜宽度为至少500mm，厚度最多为50μm，其中MOR-c的最大值为1.35以下，拉伸弹性模量为5.0GPa以上 。 聚酰亚胺膜的制备方法包括以下步骤：形成含有挥发性成分的生片，并通过将生片的两端固定而通过转炉加热生片，其中在加热步骤中， 原始膜在原始膜宽度方向上的两端具有正值的取向轴角度θ，并且温度低于原始膜转移距离等于的区域中的主挥发性成分的沸点 两个固定端之间的胶片宽度。

    POLYIMIDE/METAL LAMINATE, AND ELECTRIC/ELECTRONIC EQUIPMENT BASES, MAGNETIC RECORDING BASES, SOLAR BATTERY BASES, COATING FILM FOR AEROSPACE MATERIALS AND FILMY RESISTANCE ELEMENTS WITH THE USE THEREOF
    5.
    发明授权
    POLYIMIDE/METAL LAMINATE, AND ELECTRIC/ELECTRONIC EQUIPMENT BASES, MAGNETIC RECORDING BASES, SOLAR BATTERY BASES, COATING FILM FOR AEROSPACE MATERIALS AND FILMY RESISTANCE ELEMENTS WITH THE USE THEREOF 有权
    聚酰亚胺/金属层压板和电子电子设备基础，磁记录基础，太阳能电池基，用于航空材料的涂层膜和其使用的电阻元件

    公开(公告)号：US06586081B1

    公开(公告)日：2003-07-01

    申请号：US09522469

    申请日：2000-03-09

    申请人： Masaru Nishinaka ,  Kiyokazu Akahori

    发明人： Masaru Nishinaka ,  Kiyokazu Akahori

    IPC分类号： B32B300

    CPC分类号： B32B15/08 ,  H05K1/0346 ,  H05K3/389 ,  H05K2201/0154 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, moreover, can sustain the adhesive strength at a high ratio after exposure to high temperature or high temperature and high humidity. Owing to these characteristics, these polyimide/metal laminates are appropriately usable in flexible print wiring boards, multi-layered print wiring boards, rigid flex wiring boards, tapes for TAP, semiconductor packages such as CFOs and multi chip modules (MCMs), magnetic recording films, coating films for aerospace materials and filmy resistance elements.

    摘要翻译： 公开了具有聚酰亚胺膜和层压在其上的金属层的聚酰亚胺/金属层压体，其中聚酰亚胺膜含有钛元素和使用其的柔性印刷布线板。 聚酰亚胺/金属层压体在常规条件下的粘附性优异，并且在暴露于高温或高温和高湿度之后可以以高比例维持粘合强度。 由于这些特性，这些聚酰亚胺/金属层叠体适用于柔性印刷布线板，多层印刷布线板，刚性柔性布线板，TAP带，CFO等多种半导体封装，多芯片模块（MCM），磁记录 薄膜，航空航天材料涂膜和耐电膜元件。

    Laminate
    7.
    发明授权
    Laminate 有权

    公开(公告)号：US07101619B2

    公开(公告)日：2006-09-05

    申请号：US11134655

    申请日：2005-05-20

    申请人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    发明人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    IPC分类号： B32B7/12 ,  B32B15/08

    CPC分类号： B32B15/08 ,  B32B27/34 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/146 ,  H05K3/181 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.