发明授权
US06207739B1 Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them
有权
含有金属的聚酰胺酸组合物，聚酰亚胺膜，柔性印刷线路板及其制造方法
- 专利标题： Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them
- 专利标题（中）： 含有金属的聚酰胺酸组合物，聚酰亚胺膜，柔性印刷线路板及其制造方法
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申请号： US09196310申请日： 1998-11-20
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公开(公告)号： US06207739B1公开(公告)日： 2001-03-27
- 发明人: Kuzuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
- 申请人： Kuzuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
- 优先权： JP9-319449 19971120; JP10-038286 19980220
- 主分类号： C08K520
- IPC分类号： C08K520
摘要：
The object of the present invention is to provide a polyimide film, a flexible printed wiring board consisting thereof, and a polyimide molding, wherein various metal compounds are added to improve their properties and to provide them with noble properties.
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