发明申请
- 专利标题： Laminate, printed circuit board, and preparing method thereof
- 专利标题（中）： 层压板，印刷电路板及其制备方法
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申请号： US10537838申请日： 2003-12-05
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公开(公告)号： US20060048963A1公开(公告)日： 2006-03-09
- 发明人: Masaru Nishinaka , Takashi Itoh , Shigeru Tanaka , Mutsuaki Murakami
- 申请人： Masaru Nishinaka , Takashi Itoh , Shigeru Tanaka , Mutsuaki Murakami
- 优先权： JP2002354424 20021205; JP200323399 20030131; JP200371059 20030314; JP200371060 20030314; JP200377312 20030320
- 国际申请： PCT/JP03/15577 WO 20031205
- 主分类号： B32B15/08
- IPC分类号： B32B15/08
摘要：
A laminate which comprises a thermoplastic polyimide layer and a metal layer, or comprises a non-thermoplastic polyimide film layer and, formed on one or both surfaces, a thermoplastic polyimide layer and a metal layer; and a printed wiring board comprising the laminate. The laminate can be used for forming a high density circuit thereon, exhibits good resistance to further processing such as desmearing and excellent adhesion, and is excellent in adhesion reliability in a high temperature atmosphere.
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