Abstract:
An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.
Abstract:
The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.
Abstract:
Method of handling a substrate support structure for clamping a substrate on a surface thereof in a lithography system. First, a substrate support structure adapted to absorb energy from a substrate clamped thereon and a substrate are provided. The substrate is clamped on a surface of the substrate support structure. The substrate support structure with the substrate clamped thereon is transferred to a lithography apparatus, in which a lithographic process is performed on the substrate clamped onto the substrate support structure. The substrate support structure with the substrate clamped thereon is then removed from the lithography system. The substrate is removed from the substrate support structure, and the substrate support structure is conditioned by removing energy stored in the substrate support structure before providing a new substrate onto the substrate support structure.