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1.发明申请公开(公告)号：US20200091049A1
公开(公告)日：2020-03-19
申请号：US16689234
申请日：2019-11-20
发明人： YOU-FA WANG
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00 , H01L23/66
摘要： The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.
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公开(公告)号：US20180143346A1
公开(公告)日：2018-05-24
申请号：US15491146
申请日：2017-04-19
发明人： YOU-FA WANG
IPC分类号： G01V8/12
CPC分类号： G01V8/12
摘要： The present disclosure provides a portable electronic device and an optical proximity sensor module thereof. The optical proximity sensor module includes a circuit substrate, a light-emitting element, an optical proximity sensor element, a light-transmitting package structure and a light-shielding structure. The light-emitting element and the optical proximity sensor element are disposed on the circuit substrate. The light-transmitting package structure includes a first package body disposed on the circuit substrate to enclose the light-emitting element and a second package body disposed on the circuit substrate to enclose the optical proximity sensor element. The light-shielding structure is disposed on the light-transmitting package structure to enclose one part of the first package body and one part of the second package body. The second package body has a second exposed surface exposed from the light-shielding structure, and the second exposed surface has an inclined surface disposed above the optical proximity sensor element.
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公开(公告)号：US20190181806A1
公开(公告)日：2019-06-13
申请号：US16045282
申请日：2018-07-25
发明人： YOU-FA WANG , MENG-TONG TAN
CPC分类号： H03F1/086 , H03F1/56 , H03F3/082 , H03F3/45179 , H03F3/505 , H03F2200/541 , H03F2203/45288
摘要： Disclosed is a differential transimpedance amplifier (TIA). In the differential TIA, an input end of the first source follower is coupled to the first output end of a first differential amplification circuit. The output end of the first source follower is coupled to the second input end of a second differential amplification circuit with feedback and a first feedback resistor. The input end of a second source follower is coupled to the second output end of the first differential amplification circuit. The output end of the second source follower is coupled to the first input end of the second differential amplification circuit with feedback and a second feedback resistor. A photo diode and a dummy diode are coupled respectively to two input ends of the first differential amplification circuit.
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4.发明申请公开(公告)号：US20190122971A1
公开(公告)日：2019-04-25
申请号：US16107497
申请日：2018-08-21
发明人： YOU-FA WANG
IPC分类号： H01L23/495 , H01L23/66 , H01L23/00 , H01L21/48
摘要： The instant disclosure provides a method for manufacturing a package structure of a folding magnetic coupling isolator. The method includes providing a leadframe structure including a frame body and a first and a second leadframes connected to the frame body, the first and second leadframes including first and second chip-mounting portions, first and second coil portions, and a plurality of first and second pins and floated pins; disposing the first and second chips on the first and second chip-mounting portions and establishing electrical connections between the first and second chips and the first and second pins; and rotating the first leadframe relative to the frame body and moving the first leadframe to a position above or under the second leadframe, thereby electrically isolating the first leadframe from the second leadframe. The first coil portion and the second coil portion are aligned with and magnetically coupled to each other.
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公开(公告)号：US20230213953A1
公开(公告)日：2023-07-06
申请号：US17668338
申请日：2022-02-09
发明人： YOU-FA WANG , WEI SHI , DARMAYUDA IMADE
CPC分类号： G05F1/461 , H03F3/45183
摘要： A low-dropout voltage regulator is provided. The low-dropout voltage regulator includes a differential amplifier pair, a secondary amplification circuit that is self-stabilized, an output circuit, and a frequency compensation circuit. The secondary amplification circuit includes a first amplification transistor and a second amplification transistor. The first amplification transistor includes a first terminal, a second terminal, and a third terminal. The second amplification transistor includes a first terminal, a second terminal, and a third terminal. The second terminal of the first amplification transistor is electrically connected to the second terminal of the second amplification transistor to form an input terminal of the secondary amplification circuit to be connected to an output terminal of the differential amplifier pair. The frequency compensation circuit is disposed between an output terminal of the secondary amplification circuit, a second terminal of an output transistor, and a third terminal of the output transistor.
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公开(公告)号：US20190214368A1
公开(公告)日：2019-07-11
申请号：US16041174
申请日：2018-07-20
发明人： YOU-FA WANG , WEI-WEN LAI , PU-HAN LIN
IPC分类号： H01L25/065 , H01L23/495 , H01L25/00 , H01L23/31 , H01L23/66 , H01L25/16 , H01F38/14 , H01L21/56
CPC分类号： H01L25/0657 , H01F38/14 , H01L21/56 , H01L23/3121 , H01L23/495 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L23/66 , H01L24/48 , H01L25/16 , H01L25/50 , H01L2223/6611 , H01L2223/6661 , H01L2224/48091 , H01L2224/48106 , H01L2224/48245 , H01L2225/0651 , H01L2225/06531 , H01L2225/06572 , H01L2924/19042
摘要： The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.
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公开(公告)号：US20180294812A1
公开(公告)日：2018-10-11
申请号：US15481584
申请日：2017-04-07
发明人： MENG-TONG TAN , HUEY-JEN LIM , YOU-FA WANG
IPC分类号： H03K19/0175 , H03K17/567
CPC分类号： H03K19/017536
摘要： A buffer circuit receives a working supply voltage which may vary within a voltage range. The buffer circuit has a high voltage constant current buffer circuit, and in this circuit, the source of the first NMOS transistor is grounded, and drains of the first NMOS transistor and the first PMOS transistor are connected. The source of the second PMOS transistor is connected to the supply voltage input of the buffer circuit, and the drain of the second PMOS transistor is connected to the source of the first PMOS transistor. The input end of the high voltage diode connected composite transistors is connected to the supply voltage input of the buffer circuit, and the output end of the diode connected transistors is connected to the gates of first and second PMOS transistors. The first PMOS and NMOS transistors are high-voltage transistors. The second PMOS transistor is a low-voltage transistor.
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公开(公告)号：US20160246161A1
公开(公告)日：2016-08-25
申请号：US14744236
申请日：2015-06-19
发明人： YOU-FA WANG
CPC分类号： G03B15/02 , G02B3/06 , G02B3/08 , G02B19/0028 , G02B19/0066 , G03B15/05 , G03B2215/0567 , G03B2215/0592 , H01L2224/48091 , H01L2924/00014
摘要： A SMD type Fresnel LED micro flash light structure, which is adapted to a camera of a mobile phone, includes a housing, an array-type light source and a micro-cylindrical Fresnel lens. The housing has a bottom wall and a plurality of side walls, and defines a longitudinal direction and a width direction. The array-type light source is disposed on the bottom wall along the longitudinal direction. The micro-cylindrical Fresnel lens covers the housing, and includes a cylindrical plano-convex lens, and two teeth-shaped lens sections respectively arranged at two sides of the cylindrical plano-convex lens. Each teeth-shaped lens section has a plurality of bar teeth-shaped lenses. The cylindrical plano-convex lens and the bar teeth-shaped lenses are parallel to each other along the width direction. A central axis of the cylindrical plano-convex lens is corresponding to a central position of the array-type light source.
摘要翻译： 适用于移动电话的相机的SMD型菲涅耳LED微型闪光灯结构包括壳体，阵列型光源和微圆柱形菲涅尔透镜。 壳体具有底壁和多个侧壁，并且限定纵向方向和宽度方向。 阵列型光源沿纵向设置在底壁上。 微圆柱形菲涅耳透镜覆盖壳体，并且包括圆柱形平凸透镜和分别布置在圆柱形平凸透镜两侧的两个齿形透镜部分。 每个齿形透镜部分具有多个条形齿形透镜。 圆柱形平凸透镜和条形齿状透镜沿着宽度方向彼此平行。 圆柱形平凸透镜的中心轴对应于阵列型光源的中心位置。
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公开(公告)号：US20240194573A1
公开(公告)日：2024-06-13
申请号：US18526134
申请日：2023-12-01
发明人： YOU-FA WANG
IPC分类号： H01L23/495 , H01L23/00 , H01L23/31 , H01L23/66 , H01L25/065
CPC分类号： H01L23/49589 , H01L23/3107 , H01L23/49555 , H01L23/49575 , H01L23/66 , H01L24/08 , H01L25/0652 , H01L2223/6644 , H01L2223/6672 , H01L2224/08137 , H01L2224/08145 , H01L2924/13055 , H01L2924/14253 , H01L2924/1431 , H01L2924/182
摘要： A capacitive coupling package structure includes a first lead frame, a second lead frame, a plurality of transmitter modules, a plurality of receiver modules, and a spacer. The second lead frame corresponds to and is aligned with the first lead frame, and a gap is defined between the first lead frame and the second lead frame. The transmitter modules are each disposed on a first surface of the first lead frame or a second surface of the second lead frame. The receiver modules are each disposed on the first surface of the first lead frame or the second surface of the second lead frame. First and second signal output plates of the transmitter module and first and second signal input plates of the receiver module are disposed respectively through a plurality of floating leads, and are spaced apart from each other by a predetermined distance.
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公开(公告)号：US20240119210A1
公开(公告)日：2024-04-11
申请号：US18474177
申请日：2023-09-25
发明人： JIA ZHOU , YOU-FA WANG
IPC分类号： G06F30/367
CPC分类号： G06F30/367
摘要： A method for establishing an optocoupler SPICE model includes: establishing at least three performance-state optocoupler SPICE models respectively from optocoupler circuits that correspond to at least three performance states; establishing, according to a maximum performance state, a minimum performance state, and a typical performance state of the at least three performance states that correspond to the at least three performance-state optocoupler SPICE models, three selection circuits for each of an input end and an output end; and correspondingly connecting an input-end first selection circuit, an input-end second selection circuit, an input-end third selection circuit, an output-end first selection circuit, an output-end second selection circuit, and an output-end third selection circuit to two sides of the at least three performance-state optocoupler SPICE models, so as to establish the optocoupler SPICE model.
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