-
公开(公告)号：US12108137B2
公开(公告)日：2024-10-01
申请号：US18203483
申请日：2023-05-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Min Soo Kim , In Hoe Kim , Hyun Ah Oh , Sung Il Lee , Jong Ho Chung
CPC classification number: H04N23/57 , G02B7/09 , G02B27/646 , G03B5/00 , G03B13/36 , H04N23/54 , H04N23/687 , G03B2205/0007
Abstract: A camera includes a lens barrel, a holder, a filter disposed in the holder, a circuit board having an aperture, a reinforcing member including a first region corresponding to the aperture and a second region in which the circuit board is disposed, and an image sensor disposed in the first region of the reinforcing member. The first region of the reinforcing member includes a protruding part protruding farther than the second region of the reinforcing member. The image sensor is disposed on the upper surface of the protruding part.
-
2.发明授权公开(公告)号：US11513424B2
公开(公告)日：2022-11-29
申请号：US17195035
申请日：2021-03-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok Park , Tae Young Kim , Hyun Ah Oh , Youn Baek Jeong
IPC: G03B17/12 , G03B17/02 , G03B19/22 , H01F7/08 , H01F7/16 , H04N5/225 , H04N5/232 , H04N5/247 , H04N5/335 , G03B3/10 , G03B5/00 , G03B30/00
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
-
公开(公告)号：US10652446B2
公开(公告)日：2020-05-12
申请号：US16356952
申请日：2019-03-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Min Ha , Hyun Ah Oh
IPC: H04N5/225 , G02B27/64 , G02B7/08 , H04M1/02 , H04B1/3827
Abstract: The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.
-
公开(公告)号：US11991429B2
公开(公告)日：2024-05-21
申请号：US17310909
申请日：2020-02-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Ah Oh
Abstract: A camera module is provided. A camera module according to one aspect of the present invention comprises: a substrate comprising a window; an image sensor coupled to the lower surface of the substrate; and a filter coupled to the upper surface of the image sensor and arranged on the window.
-
公开(公告)号：US11706519B2
公开(公告)日：2023-07-18
申请号：US17864680
申请日：2022-07-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Min Soo Kim , In Hoe Kim , Hyun Ah Oh , Sung Il Lee , Jong Ho Chung
CPC classification number: H04N23/57 , G02B7/09 , G02B27/646 , G03B5/00 , G03B13/36 , H04N23/54 , H04N23/687 , G03B2205/0007
Abstract: A camera includes a lens barrel, a holder, a filter disposed in the holder, a circuit board having an aperture, a reinforcing member including a first region corresponding to the aperture and a second region in which the circuit board is disposed, and an image sensor disposed in the first region of the reinforcing member. The first region of the reinforcing member includes a protruding part protruding farther than the second region of the reinforcing member. The image sensor is disposed on the upper surface of the protruding part.
-
Patent Agency Ranking
公开(公告)号：US09531933B2
公开(公告)日：2016-12-27
申请号：US14930300
申请日：2015-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Ah Oh , Youn Baek Jeong , Se Jin Lee
CPC classification number: H04N5/2257 , G02B5/208 , G02B7/025 , G02B7/09 , G02B27/0006 , H04N5/2253 , H04N5/23241 , H04N2201/03191
Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
-
公开(公告)号：US09197796B2
公开(公告)日：2015-11-24
申请号：US13683091
申请日：2012-11-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Ah Oh , Youn Baek Jeong , Se Jin Lee
IPC: H04N5/225
CPC classification number: H04N5/2257 , G02B5/208 , G02B7/025 , G02B7/09 , G02B27/0006 , H04N5/2253 , H04N5/23241 , H04N2201/03191
Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
Abstract translation: 提出了相机模块的示例性实施例，相机模块包括安装有图像传感器的PCB（印刷电路板），安装在PCB的上表面处的基座，并且在与图像相对应的位置处形成有窗口 传感器，安装在基座的上表面的IRCF（红外线截止滤波器）和将IRCF固定到基座上的粘合构件。
-
8.发明授权公开(公告)号：US11782329B2
公开(公告)日：2023-10-10
申请号：US18050291
申请日：2022-10-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok Park , Tae Young Kim , Hyun Ah Oh , Youn Baek Jeong
IPC: G03B17/12 , H01F7/16 , G03B17/02 , G03B19/22 , H01F7/08 , H04N23/00 , H04N23/50 , H04N23/51 , H04N23/60 , H04N23/90 , H04N25/00
CPC classification number: G03B17/12 , G03B17/02 , G03B19/22 , H01F7/08 , H01F7/16 , H04N23/00 , H04N23/50 , H04N23/51 , H04N23/60 , H04N23/90 , H04N25/00
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
-
公开(公告)号：US11509805B2
公开(公告)日：2022-11-22
申请号：US16838678
申请日：2020-04-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Min Ha , Hyun Ah Oh
Abstract: The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.
-
公开(公告)号：US11418687B2
公开(公告)日：2022-08-16
申请号：US16982504
申请日：2019-03-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Min Soo Kim , In Hoe Kim , Hyun Ah Oh , Sung Il Lee , Jong Ho Chung
Abstract: An embodiment comprises: a lens barrel; a holder; a filter disposed in the holder; a circuit board having an aperture; a reinforcing member including a first region corresponding to the aperture and a second region in which the circuit board is disposed; and an image sensor disposed in the first region of the reinforcing member, wherein the first region of the reinforcing member includes a protruding part protruding farther than the second region of the reinforcing member, and the image sensor is disposed on the upper surface of the protruding part.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.016 seconds)
