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公开(公告)号：US11921301B2
公开(公告)日：2024-03-05
申请号：US18047309
申请日：2022-10-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Kap Jin Lee , Yong Nam Choi , Do Yoon Kim , Min Soo Kim , Jung Hwan Kim , Tae Young Kim
CPC classification number: G02B27/646 , G03B11/04 , H01F7/16 , H04N23/68 , H01F7/08
Abstract: The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.
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Patent Agency Ranking
公开(公告)号：US11520159B2
公开(公告)日：2022-12-06
申请号：US16466958
申请日：2018-01-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Kap Jin Lee , Yong Nam Choi , Do Yoon Kim , Min Soo Kim , Jung Hwan Kim , Tae Young Kim
Abstract: The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.
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3.发明授权公开(公告)号：US11782329B2
公开(公告)日：2023-10-10
申请号：US18050291
申请日：2022-10-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok Park , Tae Young Kim , Hyun Ah Oh , Youn Baek Jeong
IPC: G03B17/12 , H01F7/16 , G03B17/02 , G03B19/22 , H01F7/08 , H04N23/00 , H04N23/50 , H04N23/51 , H04N23/60 , H04N23/90 , H04N25/00
CPC classification number: G03B17/12 , G03B17/02 , G03B19/22 , H01F7/08 , H01F7/16 , H04N23/00 , H04N23/50 , H04N23/51 , H04N23/60 , H04N23/90 , H04N25/00
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
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4.发明授权公开(公告)号：US10969659B2
公开(公告)日：2021-04-06
申请号：US16345461
申请日：2017-11-01
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok Park , Tae Young Kim , Hyun Ah Oh , Youn Baek Jeong
IPC: G03B17/12 , G03B17/02 , G03B19/22 , H04N5/225 , H01F7/08 , H01F7/16 , H04N5/232 , H04N5/247 , H04N5/335
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
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公开(公告)号：US12276812B2
公开(公告)日：2025-04-15
申请号：US18414898
申请日：2024-01-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Kap Jin Lee , Yong Nam Choi , Do Yoon Kim , Min Soo Kim , Jung Hwan Kim , Tae Young Kim
Abstract: The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.
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6.发明授权公开(公告)号：US11513424B2
公开(公告)日：2022-11-29
申请号：US17195035
申请日：2021-03-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok Park , Tae Young Kim , Hyun Ah Oh , Youn Baek Jeong
IPC: G03B17/12 , G03B17/02 , G03B19/22 , H01F7/08 , H01F7/16 , H04N5/225 , H04N5/232 , H04N5/247 , H04N5/335 , G03B3/10 , G03B5/00 , G03B30/00
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
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