公开(公告)号：US09531933B2

公开(公告)日：2016-12-27

申请号：US14930300

申请日：2015-11-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Ah Oh ,  Youn Baek Jeong ,  Se Jin Lee

IPC: H04N5/225 ,  G02B5/20 ,  G02B7/02 ,  G02B7/09 ,  G02B27/00 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G02B5/208 ,  G02B7/025 ,  G02B7/09 ,  G02B27/0006 ,  H04N5/2253 ,  H04N5/23241 ,  H04N2201/03191

Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.

公开(公告)号：US09197796B2

公开(公告)日：2015-11-24

申请号：US13683091

申请日：2012-11-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Ah Oh ,  Youn Baek Jeong ,  Se Jin Lee

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  G02B5/208 ,  G02B7/025 ,  G02B7/09 ,  G02B27/0006 ,  H04N5/2253 ,  H04N5/23241 ,  H04N2201/03191

Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.

Abstract translation: 提出了相机模块的示例性实施例，相机模块包括安装有图像传感器的PCB（印刷电路板），安装在PCB的上表面处的基座，并且在与图像相对应的位置处形成有窗口 传感器，安装在基座的上表面的IRCF（红外线截止滤波器）和将IRCF固定到基座上的粘合构件。