摘要:
In a frequency multiplier and a method of multiplying a frequency of an external clock signal, a data output buffer, and a semiconductor device including the frequency multiplier and the data output buffer, the frequency multiplier receives an external clock signal having a predetermined frequency and outputs an internal clock signal having greater frequency than the predetermined frequency. In the semiconductor device, the data output buffer outputs data tested in response to test data. Therefore, it is possible to test a plurality of memory cells at a time by using a clock signal having a low frequency. In addition, the time and cost required for the test can be greatly reduced, and conventional testing equipment that operates at a relatively low frequency can be effectively used.
摘要:
A semiconductor device is provided having an input driver and an output receiver connected by a bus line, the bus line including pulse generating and driver circuitry responsive to threshold levels of voltage change so as to perform high speed switching which compensates for the load of the bus line.
摘要:
A semiconductor device for controlling entry to and exit from a power down mode (DPD) of a semiconductor memory, comprising a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and for generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and circuitry for controlling the timing of turning on/off the plurality of voltage generators upon entry/exit of DPD mode to reduce surge current through the semiconductor memory to less than maximum current level.
摘要:
Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.
摘要:
Integrated circuit memory devices (e.g., SDRAM) include an input buffer and a power reduction control circuit which disables the input buffer in response to an inactive chip select signal (CSB). The input buffer comprises a first differential amplifier having a first input electrically coupled to an input signal line (PX) and a first pull-up transistor electrically connected in series between a pull-up reference node of the first differential amplifier and a power supply signal line (e.g., Vcc). The output of the power reduction control circuit is electrically connected to a gate electrode of the first pull-up transistor. The first pull-up transistor can be turned off in response to an inactive chip select signal (CSB=1), to thereby electrically disconnect the first differential amplifier from its power supply. The input buffer may also comprise a first pull-down transistor electrically connected in series between an output of the first differential amplifier and a reference potential signal line (e.g., GND) and the output of the power reduction control circuit is electrically connected to a gate electrode of the first pull-down transistor.
摘要:
A parallel bit test (PBT) apparatus, included in memory chips that are stacked in a multi-chip package (MCP) and that share a set of data signal lines, may include: a comparing unit to output a data signal representative of a comparison between test data signals provided to a given one of the memory chips and corresponding data signals output therefrom, respectively; and a coding unit to output the representative data signal using a first subset of the shared set of data signal lines, the first subset not overlapping other subsets used by coding units corresponding to the other ones of the memory chips, respectively, the coding unit selecting one or more of the data signal lines amongst the shared set of data signal lines for inclusion in the first subset according to a first test mode register set (MRS) signal.
摘要:
A parallel bit test (PBT) apparatus, included in memory chips that are stacked in a multi-chip package (MCP) and that share a set of data signal lines, may include: a comparing unit to output a data signal representative of a comparison between test data signals provided to a given one of the memory chips and corresponding data signals output therefrom, respectively; and a coding unit to output the representative data signal using a first subset of the shared set of data signal lines, the first subset not overlapping other subsets used by coding units corresponding to the other ones of the memory chips, respectively, the coding unit selecting one or more of the data signal lines amongst the shared set of data signal lines for inclusion in the first subset according to a first test mode register set (MRS) signal.
摘要:
A semiconductor device is provided for controlling entry to and exit from a power down (DPD) mode of a semiconductor memory comprising; a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and biasing circuitry for biasing a plurality of nodes of at least one of the plurality of voltage generators to at least one predetermined voltage potential to prevent false triggering of circuits upon entry/exit of DPD mode. Also provided is a semiconductor device, comprising: a plurality of input buffers for buffering a plurality of DPD-type signals for signaling a power down (DPD) condition including a DPD enter/exit signal: an auxiliary buffer for separately buffering the DPD enter/exit signal; a plurality of voltage generators for supplying operating voltages to internal circuit; DPD control circuit for receiving the DPD-type signals to decode DPD enter and exit commands and for outputting a voltage generator control signal to turn off the voltage generators when DPD enter command is decoded, and to turn off the plurality of buffers excluding the auxiliary buffer; and an auto-pulse generator for generating a voltage pulse upon receiving the DPD exit command to initialize internal circuits of the semiconductor device.
摘要:
Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.
摘要:
A semiconductor integrated circuit includes a sense amplifier for amplifying an input signal and a complement of the input signal. The sense amplifier includes cross-coupled transistors. Each unique cross-coupled transistor is coupled to a corresponding unique transistor formed as a diode. A resistor is coupled in series between one cross-coupled resistor and an input port receiving the input signal, and another resistor is coupled in series between the other cross-coupled transistor and another input port receiving the complement of the input signal. Resistances associated with the sources of each cross-coupled transistor provide the resistance of the resistors.