公开(公告)号：US20030008133A1

公开(公告)日：2003-01-09

申请号：US10185002

申请日：2002-07-01

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Kyung wook Paik ,  Myung jin Yim

IPC: B05D005/12 ,  B05D003/02

CPC classification number: H01B1/22 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/10674 ,  Y10T428/26 ,  H01L2224/2919 ,  H01L2924/00 ,  H01L2224/16225

Abstract: Disclosed are an anisotropic conductive film and a method of fabricating the same suitable for realizing an ultra-fine pitch COG (Chip On Glass) application. The anisotropic conductive film of the present invention is characterized in that 1-30% by volume nonconductive particles (polymer, ceramic, etc.) having a diameter {fraction (1/20)}-null times as large as the conductive particles are added. According to the present invention, the anisotropic conductive film can prevent an electrical shorting between the bumps in bonding ultra fine pitch flip chip as well as in COG-bonding the driver IC. Accordingly, the anisotropic conductive film can be widely used in a communication field using ACA flip chip technology and universal flip chip packages.

Abstract translation: 公开了一种各向异性导电膜及其制造方法，其适用于实现超细间距COG（Glass On Glass）应用。 本发明的各向异性导电膜的特征在于，添加1〜30体积％的导电性粒子（聚合物，陶瓷等），其直径为导电粒子的1 / 20-1 / 5倍。 根据本发明，各向异性导电膜可以防止在结合超细间距倒装芯片时的凸起之间的电短路以及COG接合驱动器IC中的电短路。 因此，各向异性导电膜可以广泛用于使用ACA倒装芯片技术和通用倒装芯片封装的通信领域。

公开(公告)号：US20020111423A1

公开(公告)日：2002-08-15

申请号：US10068878

申请日：2002-02-11

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung wook Paik ,  Myung jin Yim ,  Woon seong Kwon

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H01L24/83 ,  C08L63/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2463/00 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/10674 ,  H05K2203/0783 ,  H01L2924/00

Abstract: Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.

Abstract translation: 公开了适用于射频封装应用的低介电常数导电粘合剂的制造方法。 该方法的特征在于将热固性树脂与表面处理的导电颗粒和非导电颗粒混合以防止凝集，从而形成导电粘合剂。 所制造的导电粘合剂可用于射频包装的接合材料。 根据本发明，与传统的倒装芯片接合技术相比，可以获得具有优异的机械和电气性能的倒装芯片接合。 此外，由于粘合剂具有低的高频损耗和低介电常数，所以可以实现具有优异的电性能的倒装芯片封装。 导电粘合剂对于具有微波和毫米波带宽的器件的倒装芯片封装特别有用。