公开(公告)号：US20030008133A1

公开(公告)日：2003-01-09

申请号：US10185002

申请日：2002-07-01

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Kyung wook Paik ,  Myung jin Yim

IPC: B05D005/12 ,  B05D003/02

CPC classification number: H01B1/22 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/10674 ,  Y10T428/26 ,  H01L2224/2919 ,  H01L2924/00 ,  H01L2224/16225

Abstract: Disclosed are an anisotropic conductive film and a method of fabricating the same suitable for realizing an ultra-fine pitch COG (Chip On Glass) application. The anisotropic conductive film of the present invention is characterized in that 1-30% by volume nonconductive particles (polymer, ceramic, etc.) having a diameter {fraction (1/20)}-null times as large as the conductive particles are added. According to the present invention, the anisotropic conductive film can prevent an electrical shorting between the bumps in bonding ultra fine pitch flip chip as well as in COG-bonding the driver IC. Accordingly, the anisotropic conductive film can be widely used in a communication field using ACA flip chip technology and universal flip chip packages.

Abstract translation: 公开了一种各向异性导电膜及其制造方法，其适用于实现超细间距COG（Glass On Glass）应用。 本发明的各向异性导电膜的特征在于，添加1〜30体积％的导电性粒子（聚合物，陶瓷等），其直径为导电粒子的1 / 20-1 / 5倍。 根据本发明，各向异性导电膜可以防止在结合超细间距倒装芯片时的凸起之间的电短路以及COG接合驱动器IC中的电短路。 因此，各向异性导电膜可以广泛用于使用ACA倒装芯片技术和通用倒装芯片封装的通信领域。