公开(公告)号：US20020111423A1

公开(公告)日：2002-08-15

申请号：US10068878

申请日：2002-02-11

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung wook Paik ,  Myung jin Yim ,  Woon seong Kwon

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H01L24/83 ,  C08L63/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2463/00 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/10674 ,  H05K2203/0783 ,  H01L2924/00

Abstract: Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.

Abstract translation: 公开了适用于射频封装应用的低介电常数导电粘合剂的制造方法。 该方法的特征在于将热固性树脂与表面处理的导电颗粒和非导电颗粒混合以防止凝集，从而形成导电粘合剂。 所制造的导电粘合剂可用于射频包装的接合材料。 根据本发明，与传统的倒装芯片接合技术相比，可以获得具有优异的机械和电气性能的倒装芯片接合。 此外，由于粘合剂具有低的高频损耗和低介电常数，所以可以实现具有优异的电性能的倒装芯片封装。 导电粘合剂对于具有微波和毫米波带宽的器件的倒装芯片封装特别有用。