公开(公告)号：US20230307419A1

公开(公告)日：2023-09-28

申请号：US17821632

申请日：2022-08-23

申请人： Kioxia Corporation

发明人： Soichi HOMMA ,  Chikara MIYAZAKI

IPC分类号： H01L25/065 ,  H01L25/18 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L25/18 ,  H01L21/568 ,  H01L24/95 ,  H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2225/06562 ,  H01L2225/06517 ,  H01L2224/11312 ,  H01L2224/11464 ,  H01L2224/11002 ,  H01L2224/11013 ,  H01L2224/95 ,  H01L2224/13018 ,  H01L2224/13147 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8121 ,  H01L2224/81951 ,  H01L2225/06506 ,  H01L2224/48145 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L24/45 ,  H01L2224/48105 ,  H01L24/48 ,  H01L2224/11831

摘要： A semiconductor device of an embodiment includes: a first semiconductor element; a first insulating resin that seals the first semiconductor element; a wiring substrate having a pad; a first wiring that extends from the first semiconductor element toward the wiring substrate, and has a first head portion and a first column portion, the first column portion connected to the first semiconductor element and the first head portion exposed on a surface of the first insulating resin; and a first conductive bonding agent that electrically connects the first head portion of the first wiring and the pad. When a surface of the first head portion facing a side of the first insulating resin is defined as a first surface. A surface of the first insulating resin on a side of the wiring substrate is defined as a second surface. A distance from a surface of the wiring substrate on a side of the first insulating resin to the first surface is defined as a first distance, and a distance from a surface of the wiring substrate on the side of the first insulating resin to the second surface is defined as a second distance. The first distance is shorter than the second distance.