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    Direct interlayer optical coupler
    1.
    发明授权
    Direct interlayer optical coupler 有权
    直接层间光耦合器

    公开(公告)号：US08548287B2

    公开(公告)日：2013-10-01

    申请号：US13293624

    申请日：2011-11-10

    申请人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    发明人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    IPC分类号： G02B6/12

    CPC分类号： G02B6/26 ,  Y10T29/49826

    摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

    摘要翻译： 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

    Chip package to support high-frequency processors
    2.
    发明授权
    Chip package to support high-frequency processors 有权
    芯片封装支持高频处理器

    公开(公告)号：US08982563B2

    公开(公告)日：2015-03-17

    申请号：US13171072

    申请日：2011-06-28

    申请人： Kannan Raj ,  Ivan Shubin ,  John E. Cunningham

    发明人： Kannan Raj ,  Ivan Shubin ,  John E. Cunningham

    IPC分类号： H05K7/20 ,  H05K7/10 ,  H01L25/18 ,  H01L23/538

    CPC分类号： H05K7/1092 ,  H01L23/5384 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.

    摘要翻译： 芯片封装包括处理器，插入器芯片和电压调节器模块（VRM）。 插入器芯片通过靠近插入器芯片的表面的第一电连接器电耦合到处理器。 此外，插入器芯片包括靠近插入器芯片的另一表面的第二电连接器，其通过插入器芯片中的贯穿衬底通孔（TSV）电耦合到第一电连接器。 注意，第二电连接器可以将插入器芯片电连接到电路板。 此外，VRM通过插入器芯片电耦合到处理器，并且靠近芯片封装中的处理器，从而降低电压下降。 例如，VRM可以电耦合到插入器芯片的表面，并且可以与处理器相邻。 或者，VRM可以电耦合到插入器芯片的另一表面。

    CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS
    3.
    发明申请
    CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS 有权
    芯片包支持高频处理器

    公开(公告)号：US20130003310A1

    公开(公告)日：2013-01-03

    申请号：US13171072

    申请日：2011-06-28

    申请人： Kannan Raj ,  Ivan Shubin ,  John E. Cunningham

    发明人： Kannan Raj ,  Ivan Shubin ,  John E. Cunningham

    IPC分类号： H05K7/00 ,  H05K7/20

    CPC分类号： H05K7/1092 ,  H01L23/5384 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.

    摘要翻译： 芯片封装包括处理器，插入器芯片和电压调节器模块（VRM）。 插入器芯片通过靠近插入器芯片的表面的第一电连接器电耦合到处理器。 此外，插入器芯片包括靠近插入器芯片的另一表面的第二电连接器，其通过插入器芯片中的贯穿衬底通孔（TSV）电耦合到第一电连接器。 注意，第二电连接器可以将插入器芯片电连接到电路板。 此外，VRM通过插入器芯片电耦合到处理器，并且靠近芯片封装中的处理器，从而降低电压下降。 例如，VRM可以电耦合到插入器芯片的表面，并且可以与处理器相邻。 或者，VRM可以电耦合到插入器芯片的另一表面。

    DIRECT INTERLAYER OPTICAL COUPLER
    4.
    发明申请
    DIRECT INTERLAYER OPTICAL COUPLER 有权
    直接中间层光耦合器

    公开(公告)号：US20130121635A1

    公开(公告)日：2013-05-16

    申请号：US13293624

    申请日：2011-11-10

    申请人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    发明人： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    IPC分类号： G02B6/26 ,  B23P11/00

    CPC分类号： G02B6/26 ,  Y10T29/49826

    摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

    摘要翻译： 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

    THERMAL TUNING OF AN OPTICAL DEVICE
    7.
    发明申请
    THERMAL TUNING OF AN OPTICAL DEVICE 有权
    光学装置的热调谐

    公开(公告)号：US20100247029A1

    公开(公告)日：2010-09-30

    申请号：US12415882

    申请日：2009-03-31

    申请人： Guoliang Li ,  Ashok V. Krishnamoorthy ,  John E. Cunningham ,  Ivan Shubin ,  Xuezhe Zheng

    发明人： Guoliang Li ,  Ashok V. Krishnamoorthy ,  John E. Cunningham ,  Ivan Shubin ,  Xuezhe Zheng

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12007 ,  G02B2006/12061 ,  G02F1/011 ,  G02F1/0147 ,  G02F2202/10

    摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased.

    摘要翻译： 描述了光学器件，光学器件阵列以及用于制造光学器件或阵列的技术的实施例。 该光学器件实现在基板（例如硅）上，并且包括具有对周围外部环境的高耐热性和对局部加热器的低热阻的热可调谐光波导。 特别地，与通过电极和经由基板的从光学装置中的加热器到外部环境的热耗散路径相关联的热阻增加，同时光波导和加热器之间的热阻降低。

    Hybrid substrateless device with enhanced tuning efficiency
    8.
    发明授权
    Hybrid substrateless device with enhanced tuning efficiency 有权
    具有增强调谐效率的混合无基底器件

    公开(公告)号：US08796811B2

    公开(公告)日：2014-08-05

    申请号：US13205745

    申请日：2011-08-09

    申请人： Ivan Shubin ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    发明人： Ivan Shubin ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

    IPC分类号： H01L27/12 ,  H01L21/50 ,  G02B6/10 ,  H01L27/146 ,  H01L27/148

    CPC分类号： H01L27/1465 ,  H01L21/187 ,  H01L27/14661 ,  H01L27/1467 ,  H01L27/14881 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

    摘要： In a hybrid integrated module, a semiconductor die is mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical device fabricated on a silicon-on-insulator (SOI) wafer in which the backside silicon handler has been completely removed, thereby facilitating improved device performance and highly efficient thermal tuning of the operating wavelength of the optical device. Moreover, the semiconductor die may be a VLSI chip that provides power, and serves as a mechanical handler and/or an electrical driver. The thermal tuning efficiency of the substrateless optical device may be enhanced by over 100× relative to an optical device with an intact substrate, and by 5× relative to an optical device in which the substrate has only been removed in proximity to the optical device.

    摘要翻译： 在混合集成模块中，将半导体管芯面对面地机械耦合到已经去除衬底的集成器件。 例如，集成电路可以包括制造在绝缘体上硅（SOI）晶片上的光学器件，其中背面硅处理器已经被完全去除，从而有助于改进器件性能和高效率地调谐工作波长 光学装置。 此外，半导体管芯可以是提供电力并用作机械处理器和/或电驱动器的VLSI芯片。 相对于具有完整衬底的光学器件，无基底光学器件的热调谐效率可以提高超过100倍，并且相对于其中衬底仅在光学器件附近被去除的光学器件可以提高5倍。

    Optical device with enhanced mechanical strength
    10.
    发明授权
    Optical device with enhanced mechanical strength 有权
    具有增强机械强度的光学装置

    公开(公告)号：US08600201B2

    公开(公告)日：2013-12-03

    申请号：US13032561

    申请日：2011-02-22

    申请人： Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

    发明人： Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12007

    摘要： An optical device implemented on a substrate (such as silicon) is described. This optical device includes a wavelength-sensitive optical component with a high thermal resistance to a surrounding external environment and a low thermal resistance to a localized thermal-tuning mechanism (such as a heater), which modifies a temperature of the wavelength-sensitive optical component, thereby specifying an operating wavelength of the wavelength-sensitive optical component. In particular, the thermal resistance associated with a thermal dissipation path from the thermal-tuning mechanism to the external environment via the substrate is increased by removing a portion of the substrate to create a gap that is proximate to the thermal-tuning mechanism and the wavelength-sensitive optical component. Furthermore, the optical device includes a binder material mechanically coupled to the substrate and proximate to the gap, thereby maintaining a mechanical strength of the optical device.

    摘要翻译： 描述了在衬底（例如硅）上实现的光学器件。 该光学器件包括对周围的外部环境具有高热阻的波长敏感的光学部件和对局部的热调谐机构（例如加热器）的低热阻，其改变了波长敏感光学部件的温度 从而指定波长敏感光学部件的工作波长。 特别地，通过去除衬底的一部分以产生靠近热调谐机构的间隙和波长的距离，与通过衬底从热调谐机构到外部环境的散热路径相关联的热阻增加 敏感光学部件。 此外，光学装置包括机械耦合到基板并且靠近间隙的粘合剂材料，从而保持光学装置的机械强度。