Observation method using microscopic imaging device

    公开(公告)号:US10254527B2

    公开(公告)日:2019-04-09

    申请号:US14811067

    申请日:2015-07-28

    Inventor: Soichiro Ueno

    Abstract: A certain embodiment provides an observation method using a microscopic imaging device which has a solid-state imaging device having a plurality of pixels arranged at predetermined intervals, each of the pixels including a microlens configured to collect light, and a light receiving unit configured to receive the light collected by the microlens. The observation method includes mounting an object to be observed on the microlenses or above the microlenses by disposing a specimen containing the object to be observed on the microscopic imaging device, and imaging the object to be observed, mounted on the microlenses or above the microlenses by a solid-state imaging device.

    SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE
    3.
    发明申请
    SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE 审中-公开
    固态成像装置,相机模块和制造固态成像装置的方法

    公开(公告)号:US20160172401A1

    公开(公告)日:2016-06-16

    申请号:US14958214

    申请日:2015-12-03

    CPC classification number: H01L27/14627 H01L27/14623 H01L27/14685 H04N5/2257

    Abstract: Certain embodiments provide a solid-state imaging device including a sensor substrate including a microlens, a transparent resin layer provided so as to be in contact with a main surface of the sensor substrate including a surface of the microlens, and a transparent substrate disposed on a top surface of the transparent resin layer. A thermal conductivity of the transparent resin layer is higher than that of air, and a refractive index of the transparent resin layer is lower than that of the microlens and is equal to or lower than that of the transparent substrate.

    Abstract translation: 某些实施例提供一种固态成像装置,其包括:传感器基板,包括微透镜,透明树脂层,设置成与包括微透镜的表面的传感器基板的主表面接触;以及透明基板, 透明树脂层的顶面。 透明树脂层的导热率高于空气,并且透明树脂层的折射率低于微透镜的折射率,并且等于或低于透明树脂层的折射率。

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