公开(公告)号：US10172241B2

公开(公告)日：2019-01-01

申请号：US14478279

申请日：2014-09-05

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung Wook Baek ,  Keon Jae Lee ,  Geon Tae Hwang ,  Hyeon Kyun Yoo ,  Do Hyun Kim ,  Yoo Sun Kim

IPC: H05K3/32 ,  H05K1/03 ,  H05K3/00 ,  H01L23/00

Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.

公开(公告)号：US09113586B2

公开(公告)日：2015-08-18

申请号：US13774675

申请日：2013-02-22

Applicant: LG INNOTEK CO., LTD. ,  KAIST (Korea Advanced Institute of Science and Technology)

Inventor： Jae Chun Lee ,  Kyuong-wook Paik ,  Yoo Sun Kim ,  Kiwon Lee

IPC: B23K1/06 ,  H05K13/04 ,  B23K20/10 ,  B23K20/02 ,  B23K20/00 ,  H01R43/02

CPC classification number: H05K13/046 ,  B23K1/06 ,  B23K20/00 ,  B23K20/02 ,  B23K20/023 ,  B23K20/10 ,  B23K20/106 ,  B23K2101/42 ,  H01R43/0207

Abstract: Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.

Abstract translation: 公开了一种用于将柔性PCB（印刷电路板）结合到相机模块的装置，根据本公开的示例性实施例的装置包括热压单元，其被配置为使用导电膜将相机模块连接到柔性PCB 通过对摄像机模块和柔性PCB之间的导电膜施加热和压力，构造成将超声波振动能量直接传输到摄像机模块以去除在导电膜内部固有的连接颗粒上的氧化膜的超声波波峰接合单元， 以及控制器，被配置为当所述导电膜的温度升高到预定温度时激活所述超声波接合单元。

公开(公告)号：US20150077949A1

公开(公告)日：2015-03-19

申请号：US14478279

申请日：2014-09-05

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung Wook Baek ,  Keon Jae Lee ,  Geon Tae Hwang ,  Hyeon Kyun Yoo ,  Do Hyun Kim ,  Yoo Sun Kim

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K3/323 ,  H01L24/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/0393 ,  H05K3/0058 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.

Abstract translation: 提供了一种柔性装置，其包括柔性基板，设置在柔性基板上并被配置为接触随后的各向异性导电膜然后延伸到柔性基板的一侧的多个电极线，被配置为接触 电极线，并且层压在柔性基板上，设置在各向异性导电膜上的多个凸块，以及具有设置在其一侧并被配置为接触多个凸块的电子器件的电路板。