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公开(公告)号：US10663279B2
公开(公告)日：2020-05-26
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US10598477B2
公开(公告)日：2020-03-24
申请号：US15421695
申请日：2017-02-01
Applicant: KLA—TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US20170227348A1
公开(公告)日：2017-08-10
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
IPC: G01B7/06
CPC classification number: G01B7/06
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US20130300445A1
公开(公告)日：2013-11-14
申请号：US13888201
申请日：2013-05-06
Applicant: KLA-TENCOR CORPORATION
Inventor： Walter H. Johnson , Jianou Shi , Lansheng Dong , Haijing Peng , Xianghua Liu , Jiazhou Jin , Zhuoxian Zhang , Nanchang Zhu
IPC: G01R1/067
CPC classification number: G01R1/06711 , G01R1/06733 , G01R1/06794 , G01R1/073
Abstract: A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion.
Abstract translation: 连续可变间距探针引脚装置，包括第一和第二探针。 第一和第二探针被配置成测量导电层的性质。 在第一配置中，第一和第二探针包括相应的第一部分，其布置成与导电层接触以测量该性质。 在第二配置中，第一和第二探针包括相应的第二部分，其布置成接触导电层以测量该性质。 每个相应的第一部分的第一区域与每个相应的第二部分的第二区域不同。
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公开(公告)号：US10514391B2
公开(公告)日：2019-12-24
申请号：US15665730
申请日：2017-08-01
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20200072869A1
公开(公告)日：2020-03-05
申请号：US16679223
申请日：2019-11-10
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US09435826B2
公开(公告)日：2016-09-06
申请号：US13888201
申请日：2013-05-06
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson , Jianou Shi , Lansheng Dong , Haijing Peng , Xianghua Liu , Jiazhou Jin , Zhuoxian Zhang , Nanchang Zhu
CPC classification number: G01R1/06711 , G01R1/06733 , G01R1/06794 , G01R1/073
Abstract: A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion.
Abstract translation: 连续可变间距探针引脚装置，包括第一和第二探针。 第一和第二探针被配置成测量导电层的性质。 在第一配置中，第一和第二探针包括相应的第一部分，其布置成与导电层接触以测量该性质。 在第二配置中，第一和第二探针包括相应的第二部分，其布置成接触导电层以测量该性质。 每个相应的第一部分的第一区域与每个相应的第二部分的第二区域不同。
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公开(公告)号：US11249110B2
公开(公告)日：2022-02-15
申请号：US16679223
申请日：2019-11-10
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US20180052189A1
公开(公告)日：2018-02-22
申请号：US15665730
申请日：2017-08-01
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
CPC classification number: G01R1/06761 , G01R1/06722 , G01R1/07307 , G01R1/07314 , G01R31/2831 , G01R31/2886
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US20170227347A1
公开(公告)日：2017-08-10
申请号：US15421695
申请日：2017-02-01
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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