公开(公告)号：US11249110B2

公开(公告)日：2022-02-15

申请号：US16679223

申请日：2019-11-10

Applicant: KLA-Tencor Corporation

Inventor： Walter H. Johnson, III ,  Nanchang Zhu ,  Xianghua Liu ,  Jianli Cui ,  Zhu-bin Shi ,  Zhuoxian Zhang ,  Haiyang You ,  Lu Yu ,  Jianou Shi ,  Fan Zhang

IPC: G01R1/067 ,  G01R31/28 ,  G01R1/073

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

公开(公告)号：US20180052189A1

公开(公告)日：2018-02-22

申请号：US15665730

申请日：2017-08-01

Applicant: KLA-Tencor Corporation

Inventor： Walter H. Johnson, III ,  Nanchang Zhu ,  Xianghua Liu ,  Jianli Cui ,  Zhu-bin Shi ,  Zhuoxian Zhang ,  Haiyang You ,  Lu Yu ,  Jianou Shi ,  Fan Zhang

IPC: G01R1/067 ,  G01R31/28 ,  G01R1/073

CPC classification number: G01R1/06761 ,  G01R1/06722 ,  G01R1/07307 ,  G01R1/07314 ,  G01R31/2831 ,  G01R31/2886

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

公开(公告)号：US10514391B2

公开(公告)日：2019-12-24

申请号：US15665730

申请日：2017-08-01

Applicant: KLA-Tencor Corporation

Inventor： Walter H. Johnson, III ,  Nanchang Zhu ,  Xianghua Liu ,  Jianli Cui ,  Zhu-bin Shi ,  Zhuoxian Zhang ,  Haiyang You ,  Lu Yu ,  Jianou Shi ,  Fan Zhang

IPC: G01R31/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

公开(公告)号：US20200072869A1

公开(公告)日：2020-03-05

申请号：US16679223

申请日：2019-11-10

Applicant: KLA-Tencor Corporation

Inventor： Walter H. Johnson, III ,  Nanchang Zhu ,  Xianghua Liu ,  Jianli Cui ,  Zhu-bin Shi ,  Zhuoxian Zhang ,  Haiyang You ,  Lu Yu ,  Jianou Shi ,  Fan Zhang

IPC: G01R1/067 ,  G01R31/28 ,  G01R1/073

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.